A brief overview of MEMS-related terminology.
|MEMS||Abbreviation for Micro Electro Mechanical Systems. A general term for device systems featuring minute 3-dimensional structures for handling various input/output signals.|
|Isotropic Etching||Etching that progresses in depth and lateral direction due to radicals|
|Anisotropic Etching||Etching that progresses in depth direction due to ions|
|Bosch Process||The primary technology used for silicon deep etching. Combines both isotropic and anisotropic etching techniques.|
|Scallops||The uneven shape of the sidewalls formed by the Bosch process|
|SOI Wafers||Short for Silicon On Insulator. A silicon wafer in which a single silicon crystal layer is formed on an oxide film.|
|TAIKO Grinding||A wafer grinding process that grinds only the inner portion, leaving the outer edge of the wafer intact.
TAIKO is a trademark of Disco Corp.
|Support Wafer||Wafers that provide support during the processing and handling of thin wafers|
|Wafer Attaching||Attaching support substrates for the purpose of processing and handling thin wafers|
|Wafer Bonding||Bonding wafers together for the process of sealing|
|ALD (Atomic Layer Deposition)||A thin-film deposition method that sequentially stacks layers at the atomic level.|
The ROHM Group offers a Thin-Film Piezo MEMS Foundry Service that allows customers to achieve their ideas and designs.