A brief overview of MEMS-related terminology.
|Abbreviation for Micro Electro Mechanical Systems. A general term for device systems featuring minute 3-dimensional structures for handling various input/output signals.
|Etching that progresses in depth and lateral direction due to radicals
|Etching that progresses in depth direction due to ions
|The primary technology used for silicon deep etching. Combines both isotropic and anisotropic etching techniques.
|The uneven shape of the sidewalls formed by the Bosch process
|Short for Silicon On Insulator. A silicon wafer in which a single silicon crystal layer is formed on an oxide film.
|A wafer grinding process that grinds only the inner portion, leaving the outer edge of the wafer intact.
TAIKO is a trademark of Disco Corp.
|Wafers that provide support during the processing and handling of thin wafers
|Attaching support substrates for the purpose of processing and handling thin wafers
|Bonding wafers together for the process of sealing
|ALD (Atomic Layer Deposition)
|A thin-film deposition method that sequentially stacks layers at the atomic level.
The ROHM Group offers a Thin-Film Piezo MEMS Foundry Service that allows customers to achieve their ideas and designs.