DTC123EMFHA
NPN, SOT-723, R1=R2 Potential Divider Type Digital Transistor (Bias Resistor Built-in Transistor) for automotive

These are the standard products of "digital transistors" which ROHM invented and marketed first in the world.

Product Detail

 
Part Number | DTC123EMFHAT2L
Status | Active
Package | VMT3
Unit Quantity | 8000
Minimum Package Quantity | 8000
Packing Type | Taping
RoHS | Yes

Specifications:

Grade

Automotive

Common Standard

AEC-Q101 (Automotive Grade)

Package Code

SOT-723

Package Size [mm]

1.2x1.2 (t=0.5)

JEITA Package

SC-105AA

Number of terminal

3

Polarity

NPN

Supply voltage VCC 1[V]

50.0

Collector current Io (Ic) [A]

0.1

Input resistance R1 1[kΩ]

2.2

Emitter base Resistance R2 1[kΩ]

2.2

Power Dissipation (PD)[W]

0.15

Mounting Style

Surface mount

GI hFE

20 or more

Output Current [A]

0.1

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Features:

· Standard digital transistor
· Built-In Biasing Resistors
· Small Surface Mount Package
· Pb Free/RoHS Compliant

Design Resources

 

Technical Articles

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Transistor)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Models

  • DTC123EMFHA SPICE Model
  • DTC123EMFHA Thermal Model (lib)
  • How to Create Symbols for PSpice Models

2D/3D/CAD

  • VMT3 3D STEP Data

Characteristics Data

  • ESD Data

Packaging & Quality

Package Information

  • Package Dimensions
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Environmental Data

  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations