RV4E031RPHZG
Pch -30V -3.1A Small Signal MOSFET for Automotive

RV4E031RPHZG is a ultra-compact automotive-grade MOSFET that provides superior mounting reliability. RV4C020ZPHZG has the electrode height on the side of the package (130μm) required for vehicle applications by utilizing original Wettable Flank formation technology. The result is a consistent solder quality – even for bottom electrode type products – enabling automatic inspection machines to easily verify solder conditions after mounting. It enables greater miniaturization in automotive devices such as ADAS camera modules.

Product Detail

 
Part Number | RV4E031RPHZGTCR1
Status | Recommended
Package | DFN1616-6W (Wettable Flank)
Unit Quantity | 3000
Minimum Package Quantity | 3000
Packing Type | Taping
RoHS | Yes

Specifications:

Grade

Automotive

Common Standard

AEC-Q101 (Automotive Grade)

Package Code

DFN1616-6W

Package Size [mm]

1.6x1.6 (t=0.8)

Number of terminal

8

Polarity

Pch

Drain-Source Voltage VDSS[V]

-30

Drain Current ID[A]

-3.1

RDS(on)[Ω] VGS=4V(Typ.)

0.122

RDS(on)[Ω] VGS=4.5V(Typ.)

0.108

RDS(on)[Ω] VGS=10V(Typ.)

0.075

RDS(on)[Ω] VGS=Drive (Typ.)

0.122

Total gate charge Qg[nC]

4.8

Power Dissipation (PD)[W]

1.5

Drive Voltage[V]

-4.0

Mounting Style

Surface mount

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Features:

  • Low on - resistance.
  • Small high power package
  • Low voltage drive(4V)
  • 100% UIS tested.
  • Wettable Flank for automated optical solder inspection(AOI). Electrode part 130μm guarantee.

Design Resources

 

Technical Articles

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • What is a Thermal Model? (Transistor)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

2D/3D/CAD

  • DFN1616-6W 3D STEP Data

Packaging & Quality

Package Information

  • Moisture Sensitivity Level
  • Anti-Whisker formation

Environmental Data

  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations