UM6K31NFHA
2.5V Drive Nch+Nch MOSFET (AEC-Q101 Qualified)

Complex type MOSFETs(N+N) are made as low ON-resistance devices by the micro-processing technologies useful for wide range of applications. Broad lineup covering compact types, high-power types and complex types to meet various needs in the market.

Product Detail

 
Part Number | UM6K31NFHATCN
Status | Recommended
Package | UMT6
Unit Quantity | 3000
Minimum Package Quantity | 3000
Packing Type | Taping
RoHS | Yes

Specifications:

Grade

Automotive

Common Standard

AEC-Q101 (Automotive Grade)

Package Code

SOT-363

Package Size [mm]

2x2.1 (t=1)

JEITA Package

SC-88

Number of terminal

6

Polarity

Nch+Nch

Drain-Source Voltage VDSS[V]

60

Drain Current ID[A]

0.25

RDS(on)[Ω] VGS=2.5V(Typ.)

3.0

RDS(on)[Ω] VGS=4V(Typ.)

2.3

RDS(on)[Ω] VGS=4.5V(Typ.)

2.1

RDS(on)[Ω] VGS=10V(Typ.)

1.7

RDS(on)[Ω] VGS=Drive (Typ.)

3.0

Power Dissipation (PD)[W]

0.15

Drive Voltage[V]

2.5

Mounting Style

Surface mount

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Features:

· 2.5V-drive type
· Nch+Nch Small-signal MOSFET
· Small Surface Mount Package
· Pb Free/RoHS Compliant

Design Resources

 

Technical Articles

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • What is a Thermal Model? (Transistor)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Models

  • UM6K31NFHA SPICE Model
  • UM6K31NFHA Thermal Model (lib)
  • How to Create Symbols for PSpice Models

2D/3D/CAD

  • UMT6 STEP Data

Characteristics Data

  • ESD Data

Packaging & Quality

Package Information

  • Package Dimensions
  • Taping Information
  • Explanation for Marking
  • Condition of Soldering
  • Moisture Sensitivity Level
  • Anti-Whisker formation

Environmental Data

  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations