DA221
Low-leakage, 20V, 100mA, Series Connection, Switching Diode

ROHM's switching diodes, including diode arrays, are available in high-reliability packages and stable supply for various applications.

Data Sheet Buy * Sample *
* This is a standard-grade product.
For Automotive usage, please contact Sales.

Product Detail

 
Part Number | DA221TL
Status | Active
Package | EMD3
Unit Quantity | 3000
Minimum Package Quantity | 3000
Packing Type | Taping
RoHS | Yes

Specifications:

Grade

Standard

Configuration

Series Connection

Package Code

SOT-416

Package(JEITA)

SC-75A

Mounting Style

Surface mount

Number of terminal

3

VRM[V]

20

Reverse Voltage VR[V]

20

Average Rectified Forward Current IO[A]

0.1

IFM[A]

0.2

Isurge[mA]

300

Forward Voltage VF[V]

1.0

IF @ Forward Voltage [mA]

10.0

Reverse Current IR[µA]

0.1

VR @ Reverse Current [V]

15

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Package Size [mm]

1.6x1.6 (t=0.7)

Features:

・Ultra-small mold package(EMD3).
・High reliability.

Design Resources

 

Technical Articles

Schematic Design & Verification

  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Diode)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Models

  • DA221 SPICE Model
  • DA221 Thermal Model (lib)
  • How to Create Symbols for PSpice Models

2D/3D/CAD

  • EMD3 3D STEP Data

Characteristics Data

  • ESD Data

Packaging & Quality

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations