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analysis-center

Stories of Manufacturing

Stories of Manufacturing #01

How well can we use data?
This is where skill comes in.Quality Division Analysis Center

A growing need for different types of analysis

Given that quality assurance in semiconductor manufacturing is a major element that forms the foundation for suppliers, it is no exaggeration to say that one’s approach to quality assurance can greatly affect the level of trust in a company.
The major role of ROHM's Analysis Section is to visualize and quantify structural workmanship and defect analysis in development and mass production processes in a timely manner using advanced analytical equipment, playing an essential position in quality control as semiconductors are becoming increasingly integrated.

Visual Analysis Center’
Quality Division Analysis Center, ROHM Development Building (Ukyo-ku, Kyoto)

ROHM's innovative ‘Visual Analysis Center’.
The spatial design makes use of wood grain that provides a welcome surprise for visitors.

ROHM’s Analysis Center

A part of the Quality Division, ROHM’s Analysis Center is located in the Development Building at its headquarters in Kyoto, Japan.
Numerous analyzers placed in glass-walled corridors allow clients and visitors to view the various processes, creating a unique atmosphere that combines a high level of expertise with a human touch.

ROHM’s Analysis Center ROHM’s Analysis Center 6.tem(HF-2200) TEM(JEM-2800) FIB-SEM(SMI3050SE) FIB-SEM(NB5000) FIB(FB-2100) X線CT プラズマFIB FT-IR Raman XRF SEM-EDX(SU6600) AES XPS SEM-EDX/EBSD(SU-70)
Analysis Center Layout
Click here for details
TEM(HF-2200)

Cross-sectional analysis

Transmission Electron Microscope
(TEM)
HF-2200
HF-2200
TEM(JEM-2800)

Cross-sectional analysis

Transmission Electron Microscope
(TEM)
JEM-2800
JEM-2800
FIB-SEM(SMI3050SE)

Cross-sectional analysis

Focused Ion Beam Microscope-Scanning Electron Microscope
(TEM sample processing)
SMI3050SE
SMI3050SE
FIB-SEM(NB5000)

Cross-sectional analysis

Focused Ion Beam Microscope-Scanning Electron Microscope
(FIB-SEM)
NB5000
NB5000
FIB(FB-2100)

Cross-sectional analysis

Focused Ion Beam Microscope-Scanning Electron Microscope
(TEM sample processing)
FB-2100
FB-2100
Plasma FIB(Helios5)

Cross-sectional analysis

Xe Plasma Focused Ion Beam Microscope -Scanning Electron Microscope
(Plasma FIB)
Helios5
Helios5
FT-IR

Organics analysis

Fourier Transform Infrared Spectroscopy
(FT-IR)
iS10-continuum
iS10-continuum
Raman

Organics analysis

Laser Raman Spectorometer
NRS-5500
NRS-5500
SEM-EDX(SU6600)

Surface analysis

Scanning Electron Microscopy – Energy Dispersive X-Ray Analysis
(SEM-EDX)
SU6600
SU6600
AES

Surface analysis

Auger Electron Spectrometer
(AES)
PHI710
PHI710
XPS

Surface analysis

X-ray Photoelectron Spectrometer
(XPS)
PHI-Quantera-SXM
PHI-Quantera-SXM
SEM-EDX/EBSD(SU-70)

Surface analysis

Scanning Electron Microscopy – Energy Dispersive X-Ray Analysis
(SEM-EDX)
SU-70
SU-70
X-Ray micro-CT

Other analysis

High-resolution 3D X-ray CT System
XVA-160α
XVA-160α
XRF

Other analysis

X-Ray Fluorescence Analyzer
(XRF)
EA6000VX
EA6000VX

18 analytical engineers currently work at the center. Professionals with specialized expertise in fields such as chemistry, physics, and electronics. Director Yoshikawa, who has been at the center for 29 years, describes the role of the center.

Transmission Electron Microscope
(TEM)Cross-sectional analysis
HF-2200
HF-2200
Transmission Electron Microscope
(TEM)Cross-sectional analysis
JEM-2800
JEM-2800
Focused Ion Beam Microscope-Scanning Electron Microscope
(TEM sample processing) Cross-sectional analysis
SMI3050SE
SMI3050SE
Focused Ion Beam Microscope-Scanning Electron Microscope
(FIB-SEM)Cross-sectional analysis
NB5000
NB5000
Focused Ion Beam Microscope
(TEM sample processing)Cross-sectional analysis
FB-2100
FB-2100
High-resolution 3D X-ray CT SystemOther analysis
XVA-160α
XVA-160α
Microscopic Fourier Transform Infrared Spectrometer
(Microscopic FT-IR)Organics analysis
iS10/continuum
iS10/continuum
Laser Raman SpectorometerOrganics analysis
NRS-5500
NRS-5500
X-Ray Fluorescence Analyzer
(XRF)Other analysis
EA6000VX
EA6000VX
Xe Plasma Focused Ion Beam Microscope -Scanning Electron Microscope
(Plasma FIB)Cross-sectional analysis
Helios5
Helios5
Scanning Electron Microscope – Energy Dispersive X-ray Analysis
(SEM-EDX)Surface analysis
SU6600
SU6600
Auger Electron Spectrometer
(AES)Surface analysis
PHI710
PHI710
X-ray Photoelectron Spectrometer
(XPS)Surface analysis
PHI Quantera SXM
PHI Quantera SXM
Scanning Electron Microscopy – Energy Dispersive X-Ray Analysis
(SEM-EDX)Surface analysis
SU-70
SU-70
chronology of company-wide quality improvement initiatives
Yoshikawa:

It is probably unusual for a semiconductor manufacturer to have this level of analytical equipment installed permanently in-house. In fact, the range of categories and contents that can be analyzed probably does not significantly differ from that of large specialized analysis facilities.
At the same time, however, equipment and technology evolve day to day, so is it really state-of-the-art? This is not always the case, and in some instances we must bring the requested data to external partner facilities. But what's our main advantage? It all comes down to the potential and skills of the analytical engineers working here.

Masao Yoshikawa  Center Director, Analysis Center, Quality Division
Masao Yoshikawa Center Director, Analysis Center, Quality Division

Plasma FIB (Focused Ion Beam)

Allows cross-sectional observation of stacked product structures. ROHM’s analysis center currently has five FIBs, the newest of which is capable of cross-sectional analysis down to several hundred microns.

What we read from analyzed data is analyzed

Yoshikawa:

It is true that it is quite challenging to master such advanced analytical equipment. However, we are not simply concerned with the technology for using the equipment, but also beyond that, to the data itself
▷ How well can we make use of the results obtained?
▷ Can we provide ‘live’ data that will be useful for the next action?
These are what we’re looking for.
This is where skill comes in. To put it simply, it equates to reading comprehension and application skills, which we believe a group of true analytical specialists must possesses.

Following these words, he talked about another important element in analysis, namely diagnosis. If the accuracy of the diagnosis, which includes questions such as ‘What should we look for?’ and ‘Is there a problem hidden here?’, is low, it will not be possible to derive the desired results.

Yoshikawa:

‘Without some predictability, this process tends to be like a thousand knocks. It takes a certain amount of experience in the field to be able to make accurate diagnoses. However, in our case, using a vertically integrated production system allows us to expand our systematic knowledge from various angles. I think there is a lot we can learn using this.’

Fourier Transform Infrared Spectroscopy(FT-IR)

Irradiating an object with infrared rays allows this analyzer to perform specific analysis of organic substances mixed in products as well as evaluation of new products and materials.

Sample Processing
Sample Processing
Hisashi Uchiyama  Group Leader, Analysis Center, Quality Division

Hisashi Uchiyama Group Leader, Analysis Center, Quality Division

‘Knowledge and experience are necessary, but I also think it's imperative to improve my skills and techniques through ingenuity and discovery.’

Satona Takada Engineer, Analysis Center, Quality Division
Satona Takada Engineer, Analysis Center, Quality Division

Transmission Electron Microscope(TEM)

Providing a more detailed analysis than the FIB equipment mentioned above, it is used to perform cross-sectional structural analysis of microdevices and evaluate device crystallinity.

‘In addition to the principles and characteristics of the analyzers that I am in charge of, it is important to have knowledge of the products themselves together with materials and processes.’

Supporting our vertically integrated production system

Since its establishment, ROHM has adopted a vertically integrated system in which everything, from ingots to packaging, is performed in-house. As a result, the range of analysis covers the entire manufacturing process, from upstream to downstream.

ROHM’s Manufacturing Strategy for Achieving Ultra-High Reliability
Yoshikawa:

‘One of the main features of this center is the close proximity/relationship with the development section. As a result we are able to meet with clients on an equal footing to share information and issues, and when necessary, involve related departments in discussions. This is another advantage of our vertically integrated production system, and what's more, an ideal environment in terms of quality control.’

Providing a more detailed analysis than the FIB equipment mentioned above

Many clients and development staff visit every day for face-to-face meetings. Good response with excellent coordination are major advantages of our in-house analysis center.

Tomonori Hiki  Group Leader, Analysis Center, Quality Division

Structural Analysis Using 3D Animation

Cross-sectional images at a pitch of 100nm are reconstructed in 3D. This allows for 3D visualization of cracks and foreign objects present in structures.

Tomonori Hiki Group Leader, Analysis Center, Quality Division

‘Each still image is stacked and corrected as they are created. The skill and effort put into observing pays off by returning compelling results to our clients.’

Knowledge sharing

ROHM has a long history of quality control, going back to 1965. The following year, we established our corporate objective of ‘quality is our top priority’, and since then the entire company has been working on quality improvement.
In the ‘90s, as business expanded we established multiple QA analysis centers at overseas locations to quickly respond to customer requests, and in 2012 the company began operation under the current name of the Quality Division Analysis Center at HQ.

chronology of company-wide quality improvement initiatives

General Manager Miki, who oversees the Quality Division, to which the Analysis Center belongs, explains the significance and purpose.

chronology of company-wide quality improvement initiatives

General Manager Miki, who oversees the Quality Division, to which the Analysis Center belongs, explains the significance and purpose.

Miki:

‘The significance of consolidating so much equipment and personnel in one location is, first of all, to provide analysis results in a flexible and timely manner while working together with the development section to create quality. The second is the great value we place on sharing knowledge accumulated over many years.’

Takashi Miki General Manager,Quality Division
Takashi Miki General Manager,Quality Division

Engineers newly assigned to the Analysis Center first work as assistants engaged in a wide range of operational support spanning the three phases of
▷ Sample Processing, ▷ Measurement, and ▷ Results Reporting under the guidance of their supervisor.

From sample processing techniques, equipment operation, and approach methods to communication with clients...
Through the experience of each case, unique practical skills cultivated over many years will permeate as shared knowledge.

At the same time, among specialists in various fields, we have engineers with accumulated experience in product development, design, and manufacturing. By stimulating the exchange of information and opinions across domains, we strive not only to improve the level of each individual, but also grow the organization as a whole

Group of craftsmen

Mr.Nishizaki, chief technical supervisor, who has been following the progress of the Analysis Center from the inside for a long time, had this to say.

Nishizaki:

‘As semiconductors become smaller and more integrated, analytical equipment and methods need to evolve on a daily basis. To enhance our value as a group of analytical professionals, I believe that each of use must have an inquisitive mind that pursues ever greater depths.’

It is precisely because new and useful information is relatively easy to obtain at this time. The fundamental approach of an analyst includes not only acquiring the latest knowledge, but also having an inquisitive nature, and it wouldn't be an exaggeration to say that the ethos that gives birth to this concept lies at the heart of ROHM’s Analysis Center .

Yoko Nishizaki  Senior Engineer, Analysis Center, Quality Division
Yoko Nishizaki Senior Engineer, Analysis Center, Quality Division

Auger Electron Spectrometer(AES)

A method designed for surface analysis on the order of a few nm, mainly used to analyze discoloration, oxidation, and the microscopic adherence of foreign matter on an object.

‘Today’s Analysis Center is staffed with young, curious engineers. I would like them to pursue whatever questions they may have or are interested in.’

In 2024, with the construction of the Manufacturing Innovation Center scheduled for completion as ROHM’s new development technology base, the roles and responsibilities of the Quality Division Analysis Center will become more important than ever. Going forward, we will continue to take on challenges without specific goals by improving quality through company-wide efforts and with the support of our craftsmen.

Quality Initiatives https://www.rohm.co.jp/company/approach-to-quality

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