Core Technologies

Compact, Lightweight, Room-temperature, Antenna-Integrated Terahertz Oscillators and DetectorsTerahertz Resonant Tunneling Diodes

Features

  • Compact, lightweight oscillators and highly sensitive detectors using a resonant tunneling diode (RTD)
  • High speed switching
    (Operable for over 25Gbps direct modulation and detection)

RTD Oscillators / Detectors

Applications

  • Non- destructive inspection (i.e. internal materials, moisture, metals)
  • Security systems
  • Medical, Bio Sensor
  • Ultra-high-speed wireless communication

Applications

Size comparison with an existence THz source

Size comparison with an existence THz source

Broadband operation and sensitive detection

Broadband operation and sensitive detection

Selectable Permeability Enables Internal Inspection

Selectable Permeability Enables Internal Inspection

Ultra-High Speed Wireless Communication

Ultra-High Speed Wireless Communication

Artificial Intelligence Processor for Machine HealthAI Processor for Predictive Maintenance in Smart Factories

Features

  • Ultra-Low Power & Communication volume by analyzing on AC Chip compared with on Cloud.

Applications

  • Machine Health Monitoring in Factory
  • Infrastructure Health Monitoring
  • Home Appliance Equipment Monitoring

TEG Chip for Abnormally Detection

TEG Chip for Abnormally Detection

Algorithm

Algorithm

Operation Flow

Operation Flow

International standardization of sensor and platform interface
(METI’s commissioned project “Joint R&D on International Standardization regarding energy saving”)
International Standardization of Smart Sensing Interface

Research areas

  • Research and demonstration of smart sensing interface standardization in the field of IoT system (e.g. Green Sensor Network system)
  • Proposition and establishment of the smart sensing interface standard as de jure standard in order to promote the sales and the usage of smart sensors worldwide

Research Example

Research Example

Reliability Design For Electronic PackagesDeformation Behavior Analysis of Electronic Materials and Packages

Research areas

  • Mate rials : Sintered silver, Solder, Resin
  • Materials characterization : Film Tensile test, Stress-Strain curve, Thermal deformation, Finite Element Method

Research Example1 : Mechanical Behaviors of Sintered Porous Silver films

Research Example1 : Mechanical Behaviors of Sintered Porous Silver films

Research Example2 : For Designing Reliable Packages

Research Example2 : For Designing Reliable Packages

Presented papers

Simulation Environment Development for Power Devices and ModulesAccurate Prediction of How Power System Works

Research areas

  • Device Modeling, Circuit Simulation, Double Pulse Test, Power Module
  • Electro-thermal Co-simulation

Power System Simulation

Device Modeling and Power Module Modeling

Device Modeling and Power Module Modeling

Electro-thermal Co-simulation

Electro-thermal Co-simulation

Presented papers

“Ultra Small, Cool Well”1200V 400A SiC Power Module

Features

  • Ultra Small size, Lightweight
  • High Power Density 15KW/cm3
  • Stray Inductance < 5nH

Applications

  • High Power DC/DC Converter for the Vehicle
  • Vehicle Traction Inverter for Motor

Spec

Spec

Appearance

Appearance

Thermal Resistance (Rthj-w)

Thermal Resistance (Rthj-w)

Thermal Shock Test (TST) : - 40°C ⇔ +150°C

Thermal Shock Test (TST) : - 40°C ⇔ +150°C

SiC Application Demonstration3-Phase 30kW Bidirectional Inverter Utilizing SiC Devices

Features

  • Demonstration of a 3-phase bidirectional inverter with over 99%(Max.) efficiency
  • Achieves 30kW output utilizing TO-247N package

Applications

  • Uninterruptible power system
  • Power circulating load equipment

SiC Devices

SiC Devices

Circuit Configuration

Circuit Configuration

Characteristics and Performance

Characteristics and Performance

Presented papers

Envelope Tracking Power Supply Using GaN-FETEnvelope Tracking Power Supply

Features

  • Small size
  • High-speed response
  • 25MHz switching DC/DC converter

Applications

  • Base station power systems

Power Amplified System

Power Amplified System

Specification

Specification

Operating Waveforms

Operating Waveforms

Characteristics Comparison

Characteristics Comparison

Presented papers