Core Technologies
Compact, Lightweight, Room-temperature, Antenna-Integrated Terahertz Oscillators and DetectorsTerahertz Resonant Tunneling Diodes
Features
- Compact, lightweight oscillators and highly sensitive detectors using a resonant tunneling diode (RTD)
- High speed switching
(Operable for over 25Gbps direct modulation and detection)
Applications
- Non- destructive inspection (i.e. internal materials, moisture, metals)
- Security systems
- Medical, Bio Sensor
- Ultra-high-speed wireless communication
Size comparison with an existence THz source
Broadband operation and sensitive detection
Selectable Permeability Enables Internal Inspection
Ultra-High Speed Wireless Communication
Artificial Intelligence Processor for Machine HealthAI Processor for Predictive Maintenance in Smart Factories
Features
- Ultra-Low Power & Communication volume by analyzing on AC Chip compared with on Cloud.
Applications
- Machine Health Monitoring in Factory
- Infrastructure Health Monitoring
- Home Appliance Equipment Monitoring
TEG Chip for Abnormally Detection
Algorithm
Operation Flow
International standardization of sensor and platform interface
(METI’s commissioned project “Joint R&D on International Standardization regarding energy saving”)International Standardization of Smart Sensing Interface
Research areas
- Research and demonstration of smart sensing interface standardization in the field of IoT system (e.g. Green Sensor Network system)
- Proposition and establishment of the smart sensing interface standard as de jure standard in order to promote the sales and the usage of smart sensors worldwide
Research Example
Reliability Design For Electronic PackagesDeformation Behavior Analysis of Electronic Materials and Packages
Research areas
- Mate rials : Sintered silver, Solder, Resin
- Materials characterization : Film Tensile test, Stress-Strain curve, Thermal deformation, Finite Element Method
Research Example1 : Mechanical Behaviors of Sintered Porous Silver films
Research Example2 : For Designing Reliable Packages
Presented papers
Simulation Environment Development for Power Devices and ModulesAccurate Prediction of How Power System Works
Research areas
- Device Modeling, Circuit Simulation, Double Pulse Test, Power Module
- Electro-thermal Co-simulation
Device Modeling and Power Module Modeling
Electro-thermal Co-simulation
Presented papers
“Ultra Small, Cool Well”1200V 400A SiC Power Module
Features
- Ultra Small size, Lightweight
- High Power Density 15KW/cm3
- Stray Inductance < 5nH
Applications
- High Power DC/DC Converter for the Vehicle
- Vehicle Traction Inverter for Motor
Spec
Appearance
Thermal Resistance (Rthj-w)
Thermal Shock Test (TST) : - 40°C ⇔ +150°C
SiC Application Demonstration3-Phase 30kW Bidirectional Inverter Utilizing SiC Devices
Features
- Demonstration of a 3-phase bidirectional inverter with over 99%(Max.) efficiency
- Achieves 30kW output utilizing TO-247N package
Applications
- Uninterruptible power system
- Power circulating load equipment
SiC Devices
Circuit Configuration
Characteristics and Performance
Presented papers
- A Fanless Operating Trans-Linked Interleaved 5kW Inverter Using SiC MOSFETs to Achieve 99% Power Conversion Efficiency
- High-Temperature Characteristics of 3-kV 4H-SiC Reverse Blocking MOSFET for High-Peformance Bidirectional Switch
- Measurement Methodology for Accurate Modeling of SiC MOSFET Switching Behavior Over Wide Voltage and Current Ranges
Envelope Tracking Power Supply Using GaN-FETEnvelope Tracking Power Supply
Features
- Small size
- High-speed response
- 25MHz switching DC/DC converter
Applications
- Base station power systems
Power Amplified System
Specification
Operating Waveforms
Characteristics Comparison
