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Fast Degradation Assessment of Die Attached Materials

Fast Degradation Assessment of Die Attached Materials

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Reliability design of back-end process

Research region

Lifetime prediction
Die attach technique

New testing

New design parameter

Presented papers:

Mechanical Characterization of Sintered Silver Materials for Power Device Packaging: A Review
Nine Point Bending Test Technique for Understanding of Sintered Silver Die Bonding Failure Mechanism
Degradation Mechanism of Silver Sintering Die Attach Based on Thermal and Mechanical Reliability Testing