TLR377GYZ (New)
Ultra Small Package & High Precision Rail-to-Rail Input/Output CMOS Operational Amplifier
TLR377GYZ (New)
Ultra Small Package & High Precision Rail-to-Rail Input/Output CMOS Operational Amplifier
TLR377GYZ is an Ultra Small Package and Rail-to-Rail Input/Output single CMOS operational amplifier. This product features low input offset voltage, low noise and low input bias current. It is suitable for equipment operating from battery power and using sensors that an amplifier.
For Automotive usage, please contact Sales.
Product Detail
Specifications:
Power Supply (Min.) [V] (+5V=5, ±5V=10)
1.8
Power Supply (Max.) [V] (+5V=5, ±5V=10)
5.5
Channel
1
Circuit Current (Typ.) [mA/ch]
0.585
Input Offset Voltage (Max.) [mV]
1
Input Bias Current (Typ.) [nA]
0.0005
Slew Rate (Typ.) [V/µs]
2
Input Voltage Range [V]
VSS to VDD
Output Voltage Range [V]
VSS+0.015 to VDD-0.035
Voltage gain (Typ.) [dB]
137
Equivalent input noise voltage (Typ.) [nV/√Hz]
12
Output current (Typ.) [mA]
25
CMRR (Typ.) [dB]
100
PSRR (Typ.) [dB]
95
GBW (Typ.) [MHz]
4
Operating Temperature (Min.) [°C]
-20
Operating Temperature (Max.) [°C]
85
Package Size [mm]
0.88x0.58(t=0.33)
Features:
- Ultra Small Package WLCSP
- Low Input Offset Voltage
- Low Noise
- Rail-to-Rail Input/Output
Supporting Information
Overview
The TLR377GYZ succeeds in balancing miniaturization with high accuracy (which has been difficult to achieve with conventional op amps) by further evolving proprietary circuit design, process, and packaging technologies cultivated over many years.
Op amps’ input offset voltage and noise generation degrade amplification accuracy and can be suppressed by increasing the size of the built-in transistors - but at the expense of miniaturization. In response, ROHM developed proprietary circuits which achieve a maximum offset voltage as low as 1mV without increasing the size of the transistors. In addition, proprietary process technology greatly reduce flicker noise, while ultra-low noise is achieved with an input equivalent noise voltage density of 12nV/√Hz by optimizing the resistive components at the element level. Furthermore, The TLR377GYZ adopts a WLCSP (Wafer Level Chip Scale Package) with a ball pitch of just 0.3mm utilizing original packaging technology. This reduces size by approximately 69% compared to conventional products and 46% over existing compact products.
Application Examples
• Smartphones, compact IoT devices equipped with measurement sensor amps, etc.
