Not Recommended for New Designs RSD100N10 - Documentation

This product cannot be used for new designs (Not recommended for design diversion).

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Application Note

Part Explanation
 
For Transistors
Temperature derating method for Safe Operating Area (SOA)
 
This application note describes temperature derating method for SOA. Note that the basic method is the same for bipolar junction transistors (BJTs).
Calculation of Power Dissipation in Switching Circuit
 
This application note describes how to calculate the power dissipation that occurs in a SiC MOSFET in a switching circuit with the SiC MOSFET during switching operations.
Notes for Temperature Measurement Using Thermocouples
 
This application note explains cautions regarding the temperature measurement. The content of this application note is generally applicable, irrespective of the types of semiconductor devices.
Two-Resistor Model for Thermal Simulation
 
This application note explains the two-resistor model, which is the simplest model among thermal models used in thermal simulations. The thermal simulations mentioned three-dimensional model thermal conduction and thermal fluid analysis tools.
Notes for Temperature Measurement Using Forward Voltage of PN Junction
 
This application note explains cautions regarding the temperature measurement Using Forward Voltage of PN Junction. The content of this application note is generally applicable, irrespective of the types of semiconductor devices.
What is a Thermal Model? (Transistor)
 
Thermal models are models for performing simulations in relation to heat among SPICE models. Simulations using the thermal models are performed to make a rough estimate during the initial stage of thermal design. This application note explains the thermal models.
Method for Monitoring Switching Waveform
 
This application note explains how to correctly monitor the switching waveforms of the power device element such as switching power supply or a motor drive circuit.
Measurement Method and Usage of Thermal Resistance RthJC
 
This application note describes how to measure and use the junction-to-case thermal resistance of a discrete semiconductor device.
Importance of Probe Calibration When Measuring Power: Deskew
 
Even when devices used for measurement are calibrated regularly, they will give incorrect results if calibration is not perfo rmed for the measurement environment. This application note explains the importance of probe calibration in power measurement environments.
Impedance Characteristics of Bypass Capacitor
 
This application note focuses on the impedance characteristics of capacitors, and explains cautions for selecting bypass capacitors.
Precautions When Measuring the Rear of the Package with a Thermocouple
 
This application note describes precautions when measuring the temperature on the rear of a package using a thermocouple to find the junction temperature of a semiconductor chip during actual operation.