DTA024XUB
PNP, SOT-323FL, R1≠R2 Leak Absorption Type Digital Transistor (Bias Resistor Built-in Transistor)

PNP -100mA -50V Digital Transistors(Bias Resistor Built-in Transistors)

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Product Detail

 
Part Number | DTA024XUBTL
Status | Active
Package | UMT3F
Unit Quantity | 3000
Minimum Package Quantity | 3000
Packing Type | Taping
RoHS | Yes

Specifications:

Grade

Standard

Package Code

SOT-323FL

JEITA Package

SC-85

Package Size[mm]

2.0x2.1 (t=0.9)

Number of terminal

3

Polarity

PNP

Supply voltage VCC 1[V]

-50.0

Collector current Io (Ic) [A]

-0.1

Input resistance R1 1 [kΩ]

22.0

Emitter base Resistance R2 1 [kΩ]

47.0

Power Dissipation (PD)[W]

0.2

Mounting Style

Surface mount

Output Current [A]

-0.05

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Features:

1) Built-In bias resistors enable the configuration of an inverter circuit without connecting external input resistors (see inner circuit).
2) The bias resistors consist of thin-film resistors with complete isolation to allow negative biasing off the input. They also have the advabtages if completely eliminating parasitic effects.
3) Only the on/off conditions need to be set for operation, making the circuit design easy.
4) Complementary NPN Type: DTC024X series.
6) Lead Free/RoHS Compliant.

Design Resources

 

Technical Articles

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • What is a Thermal Model? (Transistor)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Simulations (Login Required)

  • Method for Exporting Circuit Data (ROHM Solution Simulator)

Models

  • DTA024XUB SPICE Model

2D/3D/CAD

  • UMT3F STEP Data

Characteristics Data

  • ESD Data

Packaging & Quality

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations