BSM250D17P2E004
1700V, 250A, Half bridge, Silicon-carbide (SiC) Power Module

BSM250D17P2E004 is a half bridge module consisting of SiC-DMOSFET and SiC-SBD, suitable for motor drive, inverter, converter, photovoltaics, wind power generation, induction heating equipment.

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* This is a standard-grade product.
For Automotive usage, please contact Sales.

Product Detail

 
Part Number | BSM250D17P2E004
Status | Recommended
Package | E
Unit Quantity | 4
Minimum Package Quantity | 4
Packing Type | Corrugated Cardboard
RoHS | Yes

Specifications:

Drain-source Voltage[V]

1700

Drain Current[A]

250.0

Total Power Dissipation[W]

1800

Junction Temperature(Max.)[°C]

175

Storage Temperature (Min.)[°C]

-40

Storage Temperature (Max.)[°C]

125

Package

Half bridge

Package Size [mm]

152x57.95 (t=18)

Features:

  • Low surge, low switching loss.
  • High-speed switching possible.
  • Reduced temperature dependance.

Evaluation
Board

 
    • Drive Board
    • BSMGD2G17D24-EVK001
    • This evaluation board, BSMGD2G17D24-EVK001, is a gate driver board for full SiC Modules with the 2nd Generation 1700V SiC-MOSFET in E type housing. This evaluation board contains all the necessary components for optimal and safety driving the SiC module.

  • User's Guide Purchase Inquiry
    • Drive Board
    • TAMURA 2DUB series
    • For BSM series (1700V, E type)

  • Detail

Design Resources

 

Documents

White Paper

  • Cutting-Edge Web Simulation Tool “ROHM Solution Simulator” Capable of Complete Circuit Verification of Power Devices and Driver ICs

User's Guide

  • Evaluation Board for E-type Full SiC Module with 2nd Generation 1700V SiC-MOSFET

Technical Articles

Schematic Design & Verification

  • [NEW]Application Note for SiC Power Devices and Modules
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (SiC Power Device)
  • How to Use Thermal Models
  • Optimized heat sink assembly method for effective heat dissipation
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Models

  • BSM250D17P2E004 PLECS Model
  • BSM250D17P2E004 SPICE Simulation Evaluation Circuit
  • BSM250D17P2E004 SPICE Model
  • BSM250D17P2E004 Thermal Model (lib)
  • How to Create Symbols for PSpice Models
  • Power Module Loss Simulator - 3Phase Inverter
  • Power Module Loss Simulator - Boost Converter
  • Power Module Loss Simulator - Buck Converter

Packaging & Quality

Environmental Data

  • Compliance of the ELV directive
  • Report of SVHC under REACH Regulation

Export Information

  • About Export Regulations