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Power Management LSI for Mobile Phone - BD7185AGWL

The BD7185AGWL is an integrated Power Management LSI available in a small 80-pins 0.4mm-pitch 3.8mm-by- 3.8mm Wafer-level CSP package, which is designed to meet demands for space-constrained Smart phones.

The device provides 5-Buck Converters.
The device also includes 12 general-purpose LDOs providing a wide range of voltage and current capabilities.

All Buck Converters and LDOs are fully controllable by the I²C interface. The BD7185AGWL is very easy to use in any mobile platforms.

* This product is a STANDARD grade product and not recommend for on-vehicle devices.
Part Number | BD7185AGWL-E2
Status | Active
Package | UCSP50L3C
Unit Quantity | 2500
Minimum Package Quantity | 2500
Packing Type | Taping
RoHS | Yes

Specifications:

ch

5

Vin1(Min.)[V]

2.6

Vin1(Max.)[V]

5.5

Serial I/F

I2C

Operating Temperature (Min.)[°C]

-35

Operating Temperature (Max.)[°C]

85

Features:

· 5-channel high-efficiency Buck Converters
  (16-step adjustable VO by I²C)
· 12-channel CMOS-type LDO
  (16-step adjustable VO by I²C)
· LDO and Buck Converter power ON/OFF control by
  I²C interface or external pin.
· Power ON/OFF sequence.
· 32.768kHz OSC and output buffer.
· 4-to-1 analog switch.
· TCXO buffer.
· SIM card I/F
· I²C compatible Interface.
· I²C device address changeable by ADRS pin.
  (Device address is “1001011”,”1001100”)
· Small and thin CSP package
  (3.8mm × 3.8mm height 0.57mm max)