BD1HD500EFJ-C
Automotive IPS series 1ch High-side switch

BD1HD500EFJ-C is an Automotive 1ch High-Side switch. It has a built-in overcurrent protection circuit, Thermal Shut Down (TSD) circuit, Open Load Detection circuit, Under Voltage Lock Out circuit, and has diagnostic (ST) output function at the time during abnormal detection.

Data Sheet Buy Sample
Data Sheet Buy Sample
  • Tools  
  • Packaging & Quality  
  • FAQs
  • Contact Us

Product Detail

 
Part Number | BD1HD500EFJ-CE2
Status | Recommended
Package | HTSOP-J8
Unit Quantity | 2500
Minimum Package Quantity | 2500
Packing Type | Taping
RoHS | Yes
Functional Safety | FS supportive

Specifications:

Grade

Automotive

Common Standard

AEC-Q100 (Automotive Grade)

Channel Number [ch]

1

Drain-Source Voltage (Max.)[V]

44.5

Output Current[A]

0.8

ON Resistance [mΩ]

500

Over Current Detect [A]

0.8

Active Clamp Energy [mJ]

33.0

Supply Voltage(Min.)[V]

4

Supply Voltage(Max.)[V]

18

Current consumption(Typ.)[µA]

1500

Thermal Shut Down

Self-restart

Open Load Detect [V]

2.8

Status Terminal

Available

Junction Temperature Tj (Min.)[°C]

-40

Junction Temperature Tj (Max.)[°C]

150

Features:

  • Built-in overcurrent protection circuit
  • Built-in Thermal Shut Down (TSD)
  • Built-in Open Load Detection circuit (When Output is OFF)
  • Possibility to control directly from CMOS logic IC
  • Low standby current
  • Built-in Under Voltage Lock Out circuit
  • Built-in diagnostic (ST) output function
  • Low On resistance of RDS (ON) =500mΩ (Typ) (VDD=12V, Ta=25°C, IOUT=0.25A)
  • Monolithic power IC that has a built in control part (CMOS) and a power MOS FET on 1chip
  • 1ch High-side switch for the mechanical relay coil drive
  • AEC-Q100 qualified
SHOW/HIDE COLUMNS
New Product List

Design Resources

 

Technical Articles

Schematic Design & Verification

  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Thermal Resistance

Tools

Models

  • 1ch High-Side Switch IC BD1Hx500 Series SPICE Modeling Report
  • BD1HD500EFJ-C SPICE Model

2D/3D/CAD

  • HTSOP-J8 Footprint / Symbol
  • HTSOP-J8 3D STEP Data

Packaging & Quality

Package Information

  • Package Information
  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)