BD1HC500HFN-C
Automotive IPS series 1ch High-side switch

BD1HC500HFN-C is an Automotive 1ch High-Side switch. It has a built-in overcurrent protection circuit, Thermal Shut Down (TSD) circuit, Open Load Detection circuit, Under Voltage Lock Out circuit, and has diagnostic (ST) output function at the time during abnormal detection.

Product Detail

 
Part Number | BD1HC500HFN-CTR
Status | Recommended
Package | HSON8
Unit Quantity | 3000
Minimum Package Quantity | 3000
Packing Type | Taping
RoHS | Yes

Functional Safety:

Category : FS supportive
A product that has been developed for automotive use and is capable of supporting safety analysis with regard to the functional safety.

Specifications:

Grade

Automotive

Common Standard

AEC-Q100 (Automotive Grade)

Channel Number [ch]

1

Drain-Source Voltage (Max.)[V]

44.5

Output Current[A]

0.8

ON Resistance [mΩ]

500

Over Current Detect [A]

0.8

Active Clamp Energy [mJ]

33.0

Supply Voltage(Min.)[V]

4

Supply Voltage(Max.)[V]

18

Current consumption(Typ.)[µA]

1500

Thermal Shut Down

Off-Latch

Open Load Detect [V]

2.8

Status Terminal

Available

Junction Temperature Tj (Min.)[°C]

-40

Junction Temperature Tj (Max.)[°C]

150

Package Size [mm]

2.9x3(t=0.6)

Features:

  • Built-in overcurrent protection circuit
  • Built-in Thermal Shut Down (TSD)
  • Built-in Open Load Detection circuit (When Output is OFF)
  • Possibility to control directly from CMOS logic IC
  • Low standby current
  • Built-in Under Voltage Lock Out circuit
  • Built-in diagnostic (ST) output function
  • Low On resistance of RDS (ON) =500mΩ (Typ) (VDD=12V, Ta=25°C, IOUT=0.25A)
  • Monolithic power IC that has a built in control part (CMOS) and a power MOS FET on 1chip
  • 1ch High-side switch for the mechanical relay coil drive
  • AEC-Q100 qualified

Design Resources

 

Documents

Application Note

  • BDxxHC5 Series Application Information

Technical Articles

Schematic Design & Verification

  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Thermal Resistance

Tools

Models

  • 1ch High-Side Switch IC BD1Hx500 Series SPICE Modeling Report
  • BD1HC500HFN-C SPICE Model

2D/3D/CAD

  • HSON8 Footprint / Symbol
  • HSON8 3D STEP Data

Packaging & Quality

Package Information

  • Package Information
  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)