Application Note
- BDxxHC5 Series Application Information
BD1HC500FVM-C
BD1HC500FVM-C
Automotive IPS series 1ch High-side switch
BD1HC500FVM-C is an Automotive 1ch High-Side switch. It has a built-in overcurrent protection circuit, Thermal Shut Down (TSD) circuit, Open Load Detection circuit, Under Voltage Lock Out circuit, and has diagnostic (ST) output function at the time during abnormal detection.
Product Detail
Part Number | BD1HC500FVM-CTR
Status |
Recommended
Package |
MSOP8
Unit Quantity | 3000
Minimum Package Quantity | 3000
Packing Type | Taping
RoHS |
Yes
Functional Safety:
Category : FS supportive
A product that has been developed for automotive use and is capable of supporting safety analysis with regard to the functional safety.
Specifications:
Grade
Automotive
Common Standard
AEC-Q100 (Automotive Grade)
Channel Number [ch]
1
Drain-Source Voltage (Max.)[V]
44.5
Output Current[A]
0.8
ON Resistance [mΩ]
500
Over Current Detect [A]
0.8
Active Clamp Energy [mJ]
33.0
Supply Voltage(Min.)[V]
4
Supply Voltage(Max.)[V]
18
Current consumption(Typ.)[µA]
1500
Thermal Shut Down
Off-Latch
Open Load Detect [V]
2.8
Status Terminal
Available
Junction Temperature Tj (Min.)[°C]
-40
Junction Temperature Tj (Max.)[°C]
150
Package Size [mm]
2.9x4 (t=0.9)
Features:
- Built-in overcurrent protection circuit
- Built-in Thermal Shut Down (TSD)
- Built-in Open Load Detection circuit (When Output is OFF)
- Possibility to control directly from CMOS logic IC
- Low standby current
- Built-in Under Voltage Lock Out circuit
- Built-in diagnostic (ST) output function
- Low On resistance of RDS (ON) =500mΩ (Typ) (VDD=12V, Ta=25°C, IOUT=0.25A)
- Monolithic power IC that has a built in control part (CMOS) and a power MOS FET on 1chip
- 1ch High-side switch for the mechanical relay coil drive
- AEC-Q100 qualified
Design Resources
Documents
Application Note
- BDxxHC5 Series Application Information
Technical Articles
Schematic Design & Verification
- Importance of Probe Calibration When Measuring Power: Deskew
- Impedance Characteristics of Bypass Capacitor
Thermal Design
- What Is Thermal Design
- Basics of Thermal Resistance and Heat Dissipation
- Method for Calculating Junction Temperature from Transient Thermal Resistance Data
- Thermal Resistance
Tools
Models
- Unencrypted SPICE Model (Inquiry Form)
- 1ch High-Side Switch IC BD1Hx500 Series SPICE Modeling Report
- BD1HC500FVM-C SPICE Model
2D/3D/CAD
- MSOP8 Footprint / Symbol
Packaging & Quality
Package Information
- Package Information
- Anti-Whisker formation
Manufacturing Data
- Factory Information
Environmental Data
- UL94 Flame Classifications of Mold Compound
- Compliance with the ELV directive
- REACH SVHC Non-use Declaration
- RoHS Comission Delegated Directive
Export Information
- The Export Control Order
- Export Administration Regulations(EAR)