BM6108FV-LB
Isolation Voltage 2500Vrms 1ch Gate Driver Providing Galvanic Isolation

This is the product guarantees long time support in Industrial market.
The BM6108FV-LB is a gate driver with isolation voltage 2500Vrms, I/O delay time of 150ns, and minimum input pulse width of 90ns, and incorporates the fault signal output functions, undervoltage lockout (UVLO) function, and short current protection (SCP, DESAT) function.
For sale of this product, please contact the specifications in our sales office. Currently, we don't sell this on the internet distributors now.

Product Detail

 
Part Number | BM6108FV-LBE2
Status | Recommended
Package | SSOP-B20W
Unit Quantity | 2000
Minimum Package Quantity | 2000
Packing Type | Taping
RoHS | Yes

Specifications:

Grade

Industrial

Isolation Voltage[Vrms]

2500.0

Channel

1

Vcc1(Min.)[V]

4.5

Vcc1(Max.)[V]

5.5

Vcc2(Min.)[V]

10.0

Vcc2(Max.)[V]

24.0

VEE2[V]

-12 to 0

Iout(Max.)[A]

5.0

I/O Delay Time(Max.)[ns]

150

Min. Input Pulse Width[ns]

90

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

105

Switching Controller

No

Temperature Monitor

No

Package Size [mm]

6.5x8.1 (t=2.01)

Features:

  • LongTime Support Product for Industrial Applications.
  • Providing Galvanic Isolation
  • Active Miller Clamping
  • Fault Signal Output Function (Adjustable Output Holding Time)
  • Undervoltage Lockout Function
  • Short Current Protection Function (Adjustable Reset Time)
  • Soft Turn-Off Function For Short Current Protection (Adjustable Turn-Off Time)
  • Supporting Negative VEE2
  • Output State Feedback Function

Design Resources

 

Documents

White Paper

  • Cutting-Edge Web Simulation Tool “ROHM Solution Simulator” Capable of Complete Circuit Verification of Power Devices and Driver ICs

Technical Articles

Schematic Design & Verification

  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Thermal Resistance

Tools

2D/3D/CAD

  • SSOP-B20W Footprint / Symbol

Packaging & Quality

Package Information

  • Package Information
  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)