BD68710EFV
36V High-performance, High-reliability Withstand Voltage Stepper Motor Driver

BD68710EFV is a bipolar low-consumption driver that driven by PWM current. Rated power supply voltage of the device is 36 V, and rated output current is 1.0 A. PARA-IN driving mode is adopted for input interface, and excitation mode is corresponding to FULL STEP mode, HALF STEP mode (2 types) and QUARTER STEP mode via a built-in DAC. In terms of current decay, the FAST DECAY/SLOW DECAY ratio may be set without any limitation, and all available modes may be controlled in the most appropriate way. In addition, the power supply may be driven by one single system, which simplifies the design.

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Product Detail

 
Part Number | BD68710EFV-E2
Status | Recommended
Package | HTSSOP-B28
Unit Quantity | 2500
Minimum Package Quantity | 2500
Packing Type | Taping
RoHS | Yes

Specifications:

Grade

Standard

Vcc (Max.)[V]

36.0

Power Supply Voltage (Max.) [V]

28.0

Power Supply Voltage (Min.) [V]

19.0

Iout (Max.)[A]

1.0

Iout Peak (Max.)[A]

1.5

Output On Resistance (Typ.)[Ω]

1.2

Interface

PARA-IN

Step

to 1 / 4

MIX DECAY Function

Yes

Single power supply input

Yes

Automotive class

No

Operating Temperature (Min.)[°C]

-25

Operating Temperature (Max.)[°C]

85

Package Size [mm]

9.7x6.4(t=1)

Features:

  • Rated output current (DC) 1.0A
  • Low ON resistance DMOS output
  • PARA-IN drive mode
  • PWM constant current (other oscillation)
  • Built-in spike noise cancel function
    (external noise filter is unnecessary)
  • Full-, half (two kinds)-, quarter-step functionality
  • Freely timing excitation mode switch
  • Current decay mode switch
    (linearly variable FAST/SLOW DECAY ratio)
  • Normal rotation & reverse rotation switching function
  • Power save function
  • Built-in logic input pull-down resistor
  • Power-on reset function
  • Thermal shutdown circuit (TSD)
  • Over-current protection circuit (OCP)
  • Under voltage lock out circuit (UVLO)
  • Over voltage lock out circuit (OVLO)
  • Ghost Supply Prevention
    (protects against malfunction when power supply is disconnected)
  • Adjacent pins short protection
  • Microminiature, ultra-thin and high heat-radiation
    (exposed metal type) package
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Design Resources

 

Technical Articles

Schematic Design & Verification

  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • Thermal Resistance
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

2D/3D/CAD

  • HTSSOP-B28 Footprint / Symbol
  • HTSSOP-B28 3D STEP Data

Packaging & Quality

Package Information

  • Package Information
  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Contained Report
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)