BD6381EFV
Low Voltage Series Stepper Motor Drivers

BD6382EFV,BD6381EFV,BD6380EFV are stepper motor driver series that can drive at low voltage power supply. It is suitable for the mobile devices of a battery drive by power save function. It contributes also to reduction of mounting area by ultra-thin and high heat-radiation package.

Data Sheet Buy * Sample *
* This is a standard-grade product.
For Automotive usage, please contact Sales.

Product Detail

 
Part Number | BD6381EFV-E2
Status | Recommended
Package | HTSSOP-B24
Unit Quantity | 2000
Minimum Package Quantity | 2000
Packing Type | Taping
RoHS | Yes

Specifications:

Grade

Standard

Vcc (Max.)[V]

15.0

Power Supply Voltage (Max.) [V]

13.5

Power Supply Voltage (Min.) [V]

6.0

Iout (Max.)[A]

1.2

Output On Resistance (Typ.)[Ω]

1.0

Interface

PARA-IN

Step

to 1 / 2

MIX DECAY Function

-

Single power supply input

-

Automotive class

No

Operating Temperature (Min.)[°C]

-25

Operating Temperature (Max.)[°C]

85

Package Size [mm]

7.8x7.6 (t=1)

Features:

・Low on-resistance DMOS, rated output current 1.2A
・PARALLEL-IN drive
・HALF STEP(full torque)
・Applicable to the μSTEP drive
・Power-saving function
・TSD(Thermal Shutdown) circuit
・OCP(Over Current Protection) circuit
・UVLO(Under Voltage Locked Out) circuit
・Compact, thin-shape, and high heat dissipation package
・Low voltage power supply VCC=2.5~5.5V
・Motor power supply VM=6.0~13.5V
・pin-compatible line up(BD6381EFV/BD6380EFV)

Design Resources

 

Technical Articles

Schematic Design & Verification

  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • Thermal Resistance
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

2D/3D/CAD

  • HTSSOP-B24 Footprint / Symbol
  • HTSSOP-B24 3D STEP Data

Packaging & Quality

Package Information

  • Package Information
  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Contained Report
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)