BD16939AEFV-C
Automotive 6ch Half Bridge Driver with SPI Control

The BD16939AEFV-C is 6ch half bridge driver for automotive applications. It can drive compact DC brush motors directly and each output can be controlled in three modes (High, Low and High Impedance). MCU can control the driver via 16bit Serial Peripheral Interface (SPI). The absolute voltage is 40V rated with low ON resistance packaged in compact package, which contributes to realize high reliability, low energy consumption and low cost.

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Product Detail

 
Part Number | BD16939AEFV-CE2
Status | Recommended
Package | HTSSOP-B28
Unit Quantity | 2500
Minimum Package Quantity | 2500
Packing Type | Taping
RoHS | Yes

Functional Safety:

Category : FS supportive
A product that has been developed for automotive use and is capable of supporting safety analysis with regard to the functional safety.
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Specifications:

Grade

Automotive

Common Standard

AEC-Q100 (Automotive Grade)

Vcc (Max.)[V]

40.0

Power Supply Voltage (Max.) [V]

32.0

Power Supply Voltage (Min.) [V]

6.3

Iout (Max.)[A]

1.0

Output On Resistance (Typ.)[Ω]

1.35

Number of Motors

3.0

VREF・PWM

-

Current Limit

Yes

High Speed Drive

-

Automotive class

Yes

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

125

Features:

  • AEC-Q100 Qualified (Grade 1)
  • 1.0A DMOS Half Bridge 6 Circuits
  • Three Mode Output Control (High, Low & High Impedance)
  • Low Standby Current
  • Built-in Protection Diode Against Output Reverse Voltage
  • Over Current Protection at VS Supply Stage (OCP)
  • Under Load Detection at VS Supply Stage (ULD)
  • Over Voltage Protection with OVDSEL Mode at VS Supply Stage (OVP)
  • Under Voltage Lock Out at VS Supply Stage (UVLO)
  • Thermal Shutdown (TSD), Thermal Warning (TW)
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Design Resources

 

Technical Articles

Schematic Design & Verification

  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • Thermal Resistance
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

2D/3D/CAD

  • HTSSOP-B28 Footprint / Symbol
  • HTSSOP-B28 3D STEP Data

Packaging & Quality

Manufacturing Data

  • Factory Information