RD3L08BGN
Nch 60V 80A Power MOSFET

RD3L08BGN is a power MOSFET, suitable for switching applications.

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* This is a standard-grade product.
For Automotive usage, please contact Sales.

Product Detail

 
Part Number | RD3L08BGNTL
Status | Recommended
Package | TO-252
Unit Quantity | 2500
Minimum Package Quantity | 2500
Packing Type | Taping
RoHS | Yes

Specifications:

Grade

Standard

Package Code

TO-252 (DPAK)

Package Size [mm]

6.6x9.9 (t=2.4)

JEITA Package

SC-63

Number of terminal

3

Polarity

Nch

Drain-Source Voltage VDSS[V]

60

Drain Current ID[A]

80.0

RDS(on)[Ω] VGS=4.5V(Typ.)

0.0057

RDS(on)[Ω] VGS=10V(Typ.)

0.0042

RDS(on)[Ω] VGS=Drive (Typ.)

0.0057

Total gate charge Qg[nC]

38.0

Power Dissipation (PD)[W]

119.0

Drive Voltage[V]

4.5

Mounting Style

Surface mount

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Features:

  • Low on - resistance
  • High power small mold package (TO-252)
  • Pb-free lead plating ; RoHS compliant
  • Halogen free
  • 100% Rg and UIS tested

Design Resources

 

Technical Articles

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • What is a Thermal Model? (Transistor)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Models

  • RD3L08BGN SPICE Model
  • How to Create Symbols for PSpice Models

Characteristics Data

  • RD3L08BGN ESD Data

Packaging & Quality

Package Information

  • Package Dimensions
  • Explanation for Marking
  • Condition of Soldering
  • Moisture Sensitivity Level
  • Anti-Whisker formation

Environmental Data

  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations