Models
- RD3G500GN SPICE Model
- RD3G500GN Thermal Model (lib)
- How to Create Symbols for PSpice Models
RD3G500GN
RD3G500GN
Nch 40V 50A Power MOSFET
RD3G500GN is the low on - resistance MOSFET for switching application.
Data Sheet
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* This is a standard-grade product.
For Automotive usage, please contact Sales.
For Automotive usage, please contact Sales.
Product Detail
Part Number | RD3G500GNTL
Status |
Recommended
Package |
TO-252
Unit Quantity | 2500
Minimum Package Quantity | 2500
Packing Type | Taping
RoHS |
Yes
Specifications:
Grade
Standard
Package Code
TO-252 (DPAK)
Package Size [mm]
6.6x10.0 (t=2.3)
JEITA Package
SC-63
Number of terminal
3
Polarity
Nch
Drain-Source Voltage VDSS[V]
40
Drain Current ID[A]
50.0
RDS(on)[Ω] VGS=4.5V(Typ.)
0.0047
RDS(on)[Ω] VGS=10V(Typ.)
0.0039
RDS(on)[Ω] VGS=Drive (Typ.)
0.0047
Total gate charge Qg[nC]
16.0
Power Dissipation (PD)[W]
35.0
Drive Voltage[V]
4.5
Mounting Style
Surface mount
Bare Die Part Number
Available: K4734
Storage Temperature (Min.)[°C]
-55
Storage Temperature (Max.)[°C]
150
Features:
- Low on - resistance
- High power package (TO-252)
- Pb-free lead plating ; RoHS compliant
- Halogen free
Design Resources
Documents
Data Sheet
Technical Articles
Schematic Design & Verification
Thermal Design
- What Is Thermal Design
- Basics of Thermal Resistance and Heat Dissipation
- Method for Calculating Junction Temperature from Transient Thermal Resistance Data
- Two-Resistor Model for Thermal Simulation
- Notes for Temperature Measurement Using Thermocouples
- What is a Thermal Model? (Transistor)
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- Measurement Method and Usage of Thermal Resistance RthJC
- Precautions When Measuring the Rear of the Package with a Thermocouple
Tools
Models
- RD3G500GN SPICE Model
- RD3G500GN Thermal Model (lib)
- How to Create Symbols for PSpice Models