QS5U34
1.8V Drive Nch+SBD MOSFET

ROHM MOSFETs are made as low RDS(on) resistance devices utilizing the micro-processing technologies and available in wide lineup including hybrid types (MOSFET + Schottky Barrier Diode) to meet various needs in the market.

Data Sheet Buy * Sample *
* This is a standard-grade product.
For Automotive usage, please contact Sales.

Product Detail

 
Part Number | QS5U34TR
Status | Recommended
Package | TSMT5
Unit Quantity | 3000
Minimum Package Quantity | 3000
Packing Type | Taping
RoHS | Yes

Specifications:

Grade

Standard

Package Code

SOT-25T

Package Size [mm]

2.9x2.8 (t=1.0)

Number of terminal

5

Polarity

Nch+Schottky

Drain-Source Voltage VDSS[V]

20

Drain Current ID[A]

1.5

RDS(on)[Ω] VGS=1.8V(Typ.)

0.22

RDS(on)[Ω] VGS=2.5V(Typ.)

0.17

RDS(on)[Ω] VGS=4.5V(Typ.)

0.13

RDS(on)[Ω] VGS=Drive (Typ.)

0.22

Total gate charge Qg[nC]

1.8

Power Dissipation (PD)[W]

0.9

Drive Voltage[V]

1.8

Reverse voltage VR (Diode) [V]

20.0

Forward Current IF (Diode) [A]

0.5

Forward Current Surge Peak IFSM (Diode) [A]

2.0

Mounting Style

Surface mount

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Features:

· Multiple Schottky Barrier Diodes Middle Power MOSFET
· Small Surface Mount Package
· Pb Free/RoHS Compliant

Design Resources

 

Technical Articles

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Transistor)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Models

  • QS5U34 SPICE Model
  • QS5U34 Thermal Model (lib)
  • How to Create Symbols for PSpice Models

Characteristics Data

  • ESD Data

Packaging & Quality

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Condition of Soldering
  • Moisture Sensitivity Level
  • Anti-Whisker formation

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List - Please contact us by filling in the form.
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations