BR93G56FVT-3B
2KBit, MicroWire BUS, Low Power Serial EEPROM

BR93G56-3B is serial EEPROM of serial 3-line Interface method.
They are 16bit organization and CS PIN is the third PIN in their PIN configuration.

Data Sheet Buy * Sample *
* This is a standard-grade product.
For Automotive usage, please contact Sales.

Product Detail

 
Part Number | BR93G56FVT-3BGE2
Status | Recommended
Package | TSSOP-B8
Unit Quantity | 3000
Minimum Package Quantity | 3000
Packing Type | Taping
RoHS | Yes

Specifications:

Series

BR93G-3B

Grade

Standard

I/F

MicroWire BUS(3-Wire)

Density [bit]

2k

Bit Format [Word x Bit]

128 x 16

Package

TSSOP-B8

Package Size [mm]

3x6.4 (t=1.2)

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

85

Vcc(Min.)[V]

1.7

Vcc(Max.)[V]

5.5

Circuit Current (Max.)[mA]

3.0

Standby Current (Max.)[μA]

2.0

Write Cycle (Max.)[ms]

5.0

Input Frequency (Max.)[Hz]

3M

Endurance (Max.)[Cycle]

106

Data Retention (Max.)[Year]

40

Comment

Pin rotated type. Cu wire bonding.

Features:

・ 3-line communications of chip select, serial clock, serial data input / output (the case where input and output are shared)
・ Actions available at high speed 3MHz clock (4.5V ~ 5.5V)
・ High speed write available (write time 5ms max.)
・ Same package and pin layout from 1Kbit to 16Kbit
・ 1.7~5.5V single power source action
・ Address auto increment function at read action
・ Write mistake prevention function » Write prohibition at power on » Write prohibition by command code » Write mistake prevention function at low voltage
・ Program cycle auto delete and auto end function
・ Program condition display by READY / BUSY
・ Compact package SOP8/SOP-J8/SSOP-B8/TSSOP-B8/MSOP8/ TSSOP-B8J/DIP-T8/VSON008X2030
・ Data retention for 40 years
・ Data rewrite up to 1,000,000 times
・ Data at shipment all addresses FFFFh

Design Resources

 

Technical Articles

Schematic Design & Verification

  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Thermal Resistance

Tools

2D/3D/CAD

  • TSSOP-B8 Footprint / Symbol

Packaging & Quality

Package Information

  • Package Information
  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)