BR25A256F-3M
256KBit, SPI BUS, Serial EEPROM for Automotive (105℃ Operation)

BR25A256F-3M is a 256kbit serial EEPROM of SPI BUS interface.

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Product Detail

 
Part Number | BR25A256F-3MGE2
Status | Recommended
Package | SOP8
Unit Quantity | 2500
Minimum Package Quantity | 2500
Packing Type | Taping
RoHS | Yes

Functional Safety:

Category : FS supportive
A product that has been developed for automotive use and is capable of supporting safety analysis with regard to the functional safety.
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Specifications:

Series

BR25A-3M

Grade

Automotive

Common Standard

AEC-Q100 (Automotive Grade)

I/F

SPI BUS

Density [bit]

256k

Bit Format [Word x Bit]

32k x 8

Package

SOP8

Package Size [mm]

5x6.2 (t=1.71)

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

105

Vcc(Min.)[V]

2.5

Vcc(Max.)[V]

5.5

Circuit Current (Max.)[mA]

3.0

Standby Current (Max.)[μA]

10.0

Write Cycle (Max.)[ms]

5.0

Input Frequency (Max.)[Hz]

10M

Endurance (Max.)[Cycle]

106

Data Retention (Max.)[Year]

100

Features:

· High Speed Clock Action up to 10MHz (Max.)
· Wait Function by HOLDB Terminal
· Part or Whole of Memory Arrays Settable as Read only Memory Area by Program
· 2.5V to 5.5V Single Power Source Action most Suitable.
· UP to 64Byte in Page Write Mode.
· For SPI bus interface (CPOL, CPHA) = (0, 0), (1, 1)
· Auto Erase and Auto End Function at Data Rewrite
· Low Current Consumption
· Address Auto Increment Function at Read Action
· Write Mistake Prevention Function
· More than 100 years Data Retention.
· More than 1 Million Write Cycles.
· Bit Format 32K×8
· AEC-Q100 Qualified.
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Design Resources

 

Technical Articles

Schematic Design & Verification

  • Opcode, Address, and Page Configuration for SPI BUS EEPROM
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Thermal Resistance

Tools

2D/3D/CAD

  • SOP8 Footprint / Symbol
  • SOP8 3D STEP Data

Packaging & Quality

Package Information

  • Package Information
  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)