Not Recommended for New Designs RB085BM-60FH
Schottky Barrier Diode

This product cannot be used for new designs (Not recommended for design diversion).

Product Detail

 

Replacement Product For RB085BM-60FH

Part Number
RB085BM-60FH
RB085BM-60FH
RBQ10BM65A
RBQ10BM65A
Ordering Part Number RB085BM-60FHTL RBQ10BM65ATL
Similar Level - Same Pinout, Package
Data Sheet    
Supply Status Not Recommended for New Designs Recommended
Package TO-252 TO-252
Unit Quantity 2500 2500
Minimum Packing Quantity 2500 2500
Packing Type Taping Taping
RoHS Yes Yes
Package Code TO-252 (DPAK) TO-252 (DPAK)
JEITA Package SC-63 SC-63
Grade Automotive Standard
Configuration - C-Common
Number of terminal 3 3
VRM [V] 60 65
Reverse Voltage VR [V] 60 65
Average Rectified Forward Current IO [A] 10.0 10.0
IFSM [A] 50.0 50.0
Forward Voltage VF (Max.)[V] 0.58 0.69
IF @ Forward Voltage [A] 5.0 5.0
Reverse Current IR (Max.)[mA] 0.3 0.07
VR @ Reverse Current[V] 60 65
Storage Temperature (Min.)[°C] -40 -40
Storage Temperature (Max.)[°C] 150 150
Mounting Style Surface mount Surface mount
Package Size [mm] 6.6x10.0 (t=2.2) 6.6x10.0 (t=2.2)
Common Standard AEC-Q101 (Automotive Grade) -

Design Resources

 

Technical Articles

Schematic Design & Verification

  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Diode)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Simulations (Login Required)

  • Method for Exporting Circuit Data (ROHM Solution Simulator)

Models

  • RB085BM-60FH Thermal Model (lib)
  • RB085BM-60FH SPICE Model

Characteristics Data

  • RB085BM-60FH ESD Data

Packaging & Quality

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations