Not Recommended for New Designs RF05VA2S
Fast Recovery Diode

This product cannot be used for new designs (Not recommended for design diversion).

Product Detail


Replacement Product For RF05VA2S

Part Number
Ordering Part Number RF05VA2STR RF05VAM2STR
Similar Level - Same Pinout
Data Sheet    
Supply Status Not Recommended for New Designs Recommended
Package TUMD2 TUMD2M
Unit Quantity 3000 3000
Minimum Packing Quantity 3000 3000
Packing Type Taping Taping
RoHS Yes Yes
Package Code SOD-323HE SOD-323HE
JEITA Package - SC-108B
Package Size [mm] 1.3x2.5 (t=0.8) 1.4x2.5 (t=0.8)
Grade Standard Standard
Configuration - Single
Number of terminal 2 2
VRM[V] 200 200
Reverse Voltage VR[V] 200 200
Average Rectified Forward Current IO[A] 0.5 0.5
IFSM[A] 6.0 6.0
Forward Voltage VF(Max.)[V] 0.98 0.98
IF @ Forward Voltage [A] 0.5 0.5
Reverse Current IR(Max.)[mA] 0.01 0.01
VR @ Reverse Current [V] 200 200
trr(Max.)[ns] 25 25
IF @ trr [mA] 500 500
IR @ trr [A] 1.0 1.0
Storage Temperature (Min.)[°C] -55 -55
Storage Temperature (Max.)[°C] 150 150
Mounting Style Surface mount Surface mount

Design Resources


Technical Articles

Schematic Design & Verification

  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Diode)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple



  • RF05VA2S SPICE Model
  • RF05VA2S Thermal Model (lib)
  • How to Create Symbols for PSpice Models

Packaging & Quality

Package Information

  • Package Dimensions
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Environmental Data

  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations