BU7421G
Low Power Ground Sense Operational Amplifier

Ultra Low Power CMOS Op-Amp BU7265/BU7205/BU7271/BU7245 family (Input-Output Full Swing) and BU7411 / BU7421 / BU7475 (ground sense) are monolithic IC. Supply current is very small (BU7265/BU7411 family: 0.35[µA], BU7421 family: 8.5[µA], BU7271 family: 8.6[µA]), and VDD range is +1.6[V] ~ +5.5[V] (BU7411 family: single supply), so operable with low voltage. It’s suitable for applications of portable equipments and battery movements.

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* This is a standard-grade product.
For Automotive usage, please contact Sales.

Product Detail

 
Part Number | BU7421G-TR
Status | Recommended
Package | SSOP5
Unit Quantity | 3000
Minimum Package Quantity | 3000
Packing Type | Taping
RoHS | Yes

Specifications:

Grade

Standard

Power supply (Min.) [V] (+5V=5, +/-5V=10)

1.7

Power supply (Max.) [V] (+5V=5, +/-5V=10)

5.5

Channel

1

Circuit Current (Typ.) [mA]

0.0085

Input Offset Voltage (Max.) [mV]

6.0

Input Bias Current (Typ.) [nA]

0.001

Slew Rate (Typ.) [V/µS]

0.05

Input Voltage Range [V]

VSS to VDD-1.2

Output Voltage Range [V]

VSS+0.1 to VDD-0.1

Voltage gain (Typ.) [dB]

100.0

Output current (Typ.) [mA]

4.0

CMRR (Typ.) [dB]

60.0

PSRR (Typ.) [dB]

80.0

GBW (Typ.) [MHz]

0.09

Operating Temperature (Min.) [°C]

-40

Operating Temperature (Max.) [°C]

85

Package Size [mm]

2.9x2.8 (t=1.25)

Features:

・Ultra Low Power : 8.5[μA]
・High large signal voltage gain
・Wide temperature range
    -40[℃] ~ +85[℃]
・Low input bias current 1[pA] (Typ.)
・Internal ESD protection
    Human body model (HBM) ±4000 [V] (Typ.)
・Internal phase compensation
・Low operating supply voltage
    +1.7[V] ~ +5.5[V] (single supply)

Design Resources

 

Documents

Application Note

  • Op amp Circuit Collection

Technical Articles

Schematic Design & Verification

  • Low-Side Current Sensing Circuit Design
  • Op-Amp / Comparator Tutorial
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Thermal Resistance

Tools

Models

  • BU7421G SPICE Model

2D/3D/CAD

  • SSOP5 Footprint / Symbol

Packaging & Quality

Package Information

  • Package Information
  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)