CORE TECHNOLOGIES
- Power Electronics
- Sensor Technology
- AI
Power Electronics
Understanding the fracture mechanism of packaging materialsMechanical Properties of Packaging Materials
Research region
- ・Material mechanical property
Ex. 1) Sintered silver tensile mechanical properties
Ex. 2) Epoxy molding compounds tensile mechanical properties
Ex. 1) Presented papers:
Ex. 2) Presented papers:
Reliability design of back-end processFast Degradation Assessment of Die Attached Materials
Research region
- Lifetime prediction
- Die attach technique
Presented papers:
Technology that contributes to energy saving by improvement of performanceA Method for Measuring the Characteristics of Power Transistors in the Real Operating Range
Research areas
- ・Power transistor
- ・Device characterization
- ・Device modeling
Presented papers
- High-Voltage and High-Current Id–Vds Measurement Method for Power Transistors Improved by Reducing Self-Heating
- Electrothermal Cosimulation for Predicting the Power Loss and Temperature of SiC MOSFET Dies Assembled in a Power Module
- Magnetic Near-field Strength Prediction of a Power Module by Measurement-Independent Modeling of its Structure
Introductory Video
A Method for Measuring the Characteristics of Power Transistors in the Real Operating Range
Technology that contributes to noise suppression in the development of power electronics circuits Magnetic Near-field Strength Prediction of a Power Module by Measurement-Independent Modeling of its Structure
Research areas
- ・Electromagnetic simulation
- ・Power Modules
Presented papers
Introductory Video
Magnetic Near-field Strength Prediction of a Power Module by Measurement-Independent Modeling of its Structure
Simulation Environment Development for Power Devices and ModulesAccurate Prediction of How Power System Works
Research areas
- ・Device Modeling, Circuit Simulation, Double Pulse Test, Power Module
- ・Electro-thermal Co-simulation
Device Modeling and Power Module Modeling
Electro-thermal Co-simulation
Presented papers
SiC Modules Contribute to Wireless Power Supply for In-Wheel Motors While DrivingEnabling Direct Wireless Charging While Driving Significantly Extends EV Travel Range (to Nearly Infinity in Theory)
Joint development with the Fujimoto Laboratory at Tokyo University and several other companies
2MHz/120W DC/DC Converter Using GaN-FET2MHz/120W DC/DC Converter
Features
- ・Small size
- ・Large power density
Applications
- ・Base station power systems
- ・Server power systems
Circuit Configuration
Specification
Power Conversion Efficiency Comparison
Power Density
Sensor Technology
Compact, Lightweight, Room-temperature, Antenna-Integrated Terahertz Oscillators and DetectorsTerahertz Resonant Tunneling Diodes
Features
- ・Compact, lightweight oscillators and highly sensitive detectors using a resonant tunneling diode (RTD)
- ・High speed switching
(Operable for over 25Gbps direct modulation and detection)
Applications
- ・Non- destructive inspection (i.e. internal materials, moisture, metals)
- ・Security systems
- ・Medical, Bio Sensor
- ・Ultra-high-speed wireless communication
Size comparison with an existence THz source
Broadband operation and sensitive detection
Selectable Permeability Enables Internal Inspection
Ultra-High Speed Wireless Communication
Piezoelectric MEMS Ultrasonic Transducer
Features
- ・Audible and ultrasonic band(several Hz~MHz) designs are available
- ・Circular membranes and rectangular cantilevers can be used for the diaphragm
- ・Transducer array for higher power
Applications
- ・Range finder
- ・Obstacle detection
- ・Non-contact operation
- ・Flowmeters
- ・Liquid level sensors
- ・Parametric speakers
Non-SLAM “Autonomous Mobile Robot Technology without MAP”NoMaDbot™ –No Map Driving Robot-
Features
- ・AMR (Autonomous Mobile Robot)
- ・Reaches its destination even in a changing layout
- ・Simple low-cost structure
- ・Available immediately after purchase: Requires no extra time, expertise, or technology for implementation
- ・Equipped with echolocation technology: Achieves spatial recognition through ultrasonic waves
Design Concepts
- ・Travel straight to the destination while avoiding obstacles along the way
- ・Cheap, easy, trouble-free
Markets
- ・SMEs (Small- to Medium-sized Enterprises) unable to take the risk of cost and time for implementation
- ・Factories that do not require advanced system integration
- ・Construction sites with frequent layout changes
- ・Environments with mirrored equipment, glass walls, and/or special lighting not ideal for LiDAR or cameras
Terminology
-SLAM(Simultaneous Localization and Mapping)
A technology for building a map while keeping track of location at the same time
-Echolocation
A technique used by animals to determine the distance, direction, and size of objects by emitting sounds or ultrasonic waves and detecting their reverberation.
Introductory Video
The technology satisfying the competing operation of ultra-short pulse and high powerLD Module for LiDAR
Features
- ・Ultra-short pulse (<5ns) operation compatible with high laser power (100W to 200W)
- ・Surface mounting resin-mold package
- ・LD, FET, and capacitors integrated in a compact package
Applications
- ・Autonomous driving
- ・Range finding
- ・Industrial robots
Low-inductance design is the key for ultra short pulse high-power laser
Development Roadmap
Typical characteristics of the LD module
Circuit Diagram and Appearance
Thermal conductivity hydrogen microsensor
Features
- ・Thermal conductivity sensor features long-term stability
- ・Improved accuracy in detecting hydrogen
- ・Low power consumption owning to MEMS technology
Applications
- ・Measurement of hydrogen content for a range of 0~100%
- ・Accurate detection of hydrogen leakage
- ・Measurement of contents other than hydrogen is also possible
AI
Automatic detection methodAgeing Monitoring of GaN Transistors using Recurrent Neural Networks
Research areas
- ・Reliability
- ・Machine learning
