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CORE TECHNOLOGIES
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- Power Electronics
- Sensor Technology
- AI
Power Electronics
Technology that contributes to guaranteeing stable operation of instrumentsComparative study of the ideal and actual adhesion interfaces of the die bonding structure using conductive adhesives
Research areas
- ・Semiconductor packaging
- ・Design for reliability
![Comparative study of the ideal and actual adhesion interfaces of the die bonding structure using conductive adhesives](https://www.rohm.com/documents/11303/10711752/img.png/106d3724-8643-eb26-ee39-e89c93b0d042?t=1658378083323)
Presented papers
Introductory Video
Comparative study of the ideal and actual adhesion interfaces of the die bonding structure using conductive adhesives
The technology that contributes to cost reduction of power amplifiersDeep-donor-induced suppression of current collapse in an AlGaN-GaN heterojunction structure grown on Si
Research areas
- ・Power Electronics
![Deep-donor-induced suppression of current collapse in an AlGaN-GaN heterojunction structure grown on Si](https://www.rohm.com/documents/11303/10598166/img01en.jpg/4b64faa0-4c14-8af0-8a06-1cb886f9c2d5?t=1656481590527)
Presented papers
Introductory Video
Deep-donor-induced suppression of current collapse in an AlGaN-GaN heterojunction structure grown on Si
Technology that contributes to energy saving by improvement of performanceA Method for Measuring the Characteristics of Power Transistors in the Real Operating Range
Research areas
- ・Power transistor
- ・Device characterization
- ・Device modeling
![A Method for Measuring the Characteristics of Power Transistors in the Real Operating Range](https://www.rohm.com/documents/11303/10109756/img_0412_01.png/568babeb-11e8-d89d-a55e-3b4431f810cf?t=1650616880570)
Presented papers
- High-Voltage and High-Current Id–Vds Measurement Method for Power Transistors Improved by Reducing Self-Heating
- Electrothermal Cosimulation for Predicting the Power Loss and Temperature of SiC MOSFET Dies Assembled in a Power Module
- Magnetic Near-field Strength Prediction of a Power Module by Measurement-Independent Modeling of its Structure
Introductory Video
A Method for Measuring the Characteristics of Power Transistors in the Real Operating Range
Technology that contributes to noise suppression in the development of power electronics circuits Magnetic Near-field Strength Prediction of a Power Module by Measurement-Independent Modeling of its Structure
Research areas
- ・Electromagnetic simulation
- ・Power Modules
![Calculated near field intensity distribution (dBuV)](https://www.rohm.com/documents/11303/10413800/img1.png/92e4e618-c9f9-6ef2-a73a-3b6789bff1bb?t=1655446724327)
Presented papers
Introductory Video
Magnetic Near-field Strength Prediction of a Power Module by Measurement-Independent Modeling of its Structure
Simulation Environment Development for Power Devices and ModulesAccurate Prediction of How Power System Works
Research areas
- ・Device Modeling, Circuit Simulation, Double Pulse Test, Power Module
- ・Electro-thermal Co-simulation
![Power System Simulation](https://www.rohm.com/documents/11303/9122233/img_01.jpg/12e521fb-9a81-046d-ffaf-14936beb3a16?t=1620611937057)
Device Modeling and Power Module Modeling
![Device Modeling and Power Module Modeling](https://www.rohm.com/documents/11303/9122233/img_02.jpg/734a9f5b-67b3-722d-134d-3f5bae1bb51c?t=1620611935600)
Electro-thermal Co-simulation
![Electro-thermal Co-simulation](https://www.rohm.com/documents/11303/9122233/img_03.jpg/b48cd56c-a402-9bde-1238-75e6a33557dc?t=1620611936527)
Presented papers
“Ultra Small* , Cool Well”Transfer Molded SiC Power Module
*August, 2018 ROHM survey
Features
- ・The industry’s lowest*1 thermal resistance*2
- ・Ultra-compact, lightweight
- ・High power density : 15kW/cm3
- *1:August, 2018 ROHM survey
- *2:With the same chip size, board size, and cooling capacity
Applications
- ・Automotive high-power DC/DC converters
- ・Main drive inverters in vehicles
Appearance
![Appearance](https://www.rohm.com/documents/11303/8124460/img_01.jpg/c3d0ea9d-bb71-4921-e87e-4c146dfc8fc1?t=1599719159353)
Thermal Resistance (Rthj-w)
![Thermal Resistance (Rthj-w)](https://www.rohm.com/documents/11303/8124460/img_02.jpg/2b37d05d-1d6d-5630-719e-1b1ee5198350?t=1599719159627)
Max. Junction Temperature Comparison
![Max. Junction Temperature Comparison](https://www.rohm.com/documents/11303/12031100/img_03.jpg/c1d381f5-04b7-b63b-e38f-243d81fccd8b?t=1694501380337)
SiC Modules Contribute to Wireless Power Supply for In-Wheel Motors While DrivingEnabling Direct Wireless Charging While Driving Significantly Extends EV Travel Range (to Nearly Infinity in Theory)
![SiC Modules](https://www.rohm.com/documents/11303/8124453/img_01.jpg/f35241e1-ab2c-97c6-99ef-482681d78070?t=1598509563917)
Joint development with the Fujimoto Laboratory at Tokyo University and several other companies
SiC Application Demonstration3-Phase 50kW Bidirectional Inverter Utilizing SiC Devices
![Power Assist Technology](https://www.rohm.com/documents/11303/8124426/img_06.jpg/0f0f63cb-9598-c6e0-f206-98785a19cf68?t=1598509620377)
Features
- ・Demonstration of a 3-phase bidirectional inverter that delivers over 99% (Max) efficiency
- ・Achieves 50kW output utilizing discrete devices
- ・Achieves 1.8x the output power of the previous 30kW inverter demo
Applications
- ・Grid-connected energy storage systems
- ・Uninterruptible power systems
- ・Power circulating load equipment
Overview
![Overview](https://www.rohm.com/documents/11303/8124426/img_01.jpg/afaf0a12-c3ce-7da4-d86e-1cfeb62672dc?t=1598509620593)
SiC Devices
![SiC Devices](https://www.rohm.com/documents/11303/8124426/img_02.jpg/75c7140d-4089-95c1-711b-1befdf80743a?t=1598509620810)
Circuit Configuration
![Circuit Configuration](https://www.rohm.com/documents/11303/8124426/img_03.jpg/e6e97ee1-c396-39e2-41f2-af52728eb5dc?t=1598509621010)
Characteristics
![Characteristics](https://www.rohm.com/documents/11303/8124426/img_04.jpg/9040bc5e-bd7a-9dd3-dc51-d62e5d0bc939?t=1598509621233)
Performance
![Performance](https://www.rohm.com/documents/11303/8124426/img_05.jpg/720b5754-46b3-1c14-f6aa-8ae2ec9e887c?t=1598509621443)
2MHz/120W DC/DC Converter Using GaN-FET2MHz/120W DC/DC Converter
Features
- ・Small size
- ・Large power density
Applications
- ・Base station power systems
- ・Server power systems
Circuit Configuration
![Circuit Configuration](https://www.rohm.com/documents/11303/8124407/img_01.jpg/de7148a1-dfd8-2216-49aa-11c6cb20d4cb?t=1598509740263)
Specification
![Specification](https://www.rohm.com/documents/11303/8124407/img_02.jpg/9fb98752-4a62-d039-5d56-61192adb6203?t=1598509740697)
Power Conversion Efficiency Comparison
![Power Conversion Efficiency Comparison](https://www.rohm.com/documents/11303/8124407/img_03.jpg/398d33d7-b4c6-d735-6505-5d7a3f6655cf?t=1598509741020)
Power Density
![Power Density](https://www.rohm.com/documents/11303/8124407/img_04.jpg/637d280f-ef38-f4fd-2b77-76ff6196f22a?t=1598509739917)
Reliability Design For Electronic PackagesDeformation Behavior Analysis of Electronic Materials and Packages
Research areas
- ・Mate rials : Sintered silver, Solder, Resin
- ・Materials characterization : Film Tensile test, Stress-Strain curve, Thermal deformation, Finite Element Method
Research Example1 : Mechanical Behaviors of Sintered Porous Silver films
![Research Example1 : Mechanical Behaviors of Sintered Porous Silver films](https://www.rohm.com/documents/11303/7343489/09_b01.jpg/eb4f619f-1f2e-731e-7607-00256866b85d?t=1571291012407)
Research Example2 : For Designing Reliable Packages
![Research Example2 : For Designing Reliable Packages](https://www.rohm.com/documents/11303/7343489/09_b02.jpg/46ad3ef3-3d1f-e469-c8f0-7238e029fc7c?t=1571291012710)
Presented papers
Sensor Technology
Compact, Lightweight, Room-temperature, Antenna-Integrated Terahertz Oscillators and DetectorsTerahertz Resonant Tunneling Diodes
Features
- ・Compact, lightweight oscillators and highly sensitive detectors using a resonant tunneling diode (RTD)
- ・High speed switching
(Operable for over 25Gbps direct modulation and detection)
![RTD Oscillators / Detectors](https://www.rohm.com/documents/11303/7343489/teraheltz_01_01.jpg/b20644e8-1a75-f639-3426-4359c2de9e7c?t=1571291044023)
Applications
- ・Non- destructive inspection (i.e. internal materials, moisture, metals)
- ・Security systems
- ・Medical, Bio Sensor
- ・Ultra-high-speed wireless communication
![Applications](https://www.rohm.com/documents/11303/7343489/teraheltz_02.jpg/ee8c626c-f97e-baf4-7cd4-5fc88730677f?t=1571291044300)
Size comparison with an existence THz source
![Size comparison with an existence THz source](https://www.rohm.com/documents/11303/7343489/teraheltz_b01.jpg/59c3d20d-3ef5-bb0f-fcfb-f3d601fe8350?t=1571291044563)
Broadband operation and sensitive detection
![Broadband operation and sensitive detection](https://www.rohm.com/documents/11303/7343489/teraheltz_b02.jpg/1ce51124-05ef-71d9-3161-5eb7908dd520?t=1571291044863)
Selectable Permeability Enables Internal Inspection
![Selectable Permeability Enables Internal Inspection](https://www.rohm.com/documents/11303/7343489/teraheltz_b03.jpg/7762e1ef-f597-4362-580c-d0d85e92e84c?t=1571291045130)
Ultra-High Speed Wireless Communication
![Ultra-High Speed Wireless Communication](https://www.rohm.com/documents/11303/7343489/teraheltz_b04.jpg/055a3eaa-bb50-17d6-5b42-579d77f83d6f?t=1571291045447)
Non-SLAM “Autonomous Mobile Robot Technology without MAP”NoMaDbot™ –No Map Driving Robot-
Features
- ・AMR (Autonomous Mobile Robot)
- ・Reaches its destination even in a changing layout
- ・Simple low-cost structure
- ・Available immediately after purchase: Requires no extra time, expertise, or technology for implementation
- ・Equipped with echolocation technology: Achieves spatial recognition through ultrasonic waves
![NoMaDbot™ –No Map Driving Robot-](https://www.rohm.com/documents/11303/11169093/img_NoMaDbot.png/a4c822dd-7d08-3e7c-75c0-380a82c3a67e?t=1672015743270)
Design Concepts
- ・Travel straight to the destination while avoiding obstacles along the way
- ・Cheap, easy, trouble-free
Markets
- ・SMEs (Small- to Medium-sized Enterprises) unable to take the risk of cost and time for implementation
- ・Factories that do not require advanced system integration
- ・Construction sites with frequent layout changes
- ・Environments with mirrored equipment, glass walls, and/or special lighting not ideal for LiDAR or cameras
Terminology
-SLAM(Simultaneous Localization and Mapping)
A technology for building a map while keeping track of location at the same time
-Echolocation
A technique used by animals to determine the distance, direction, and size of objects by emitting sounds or ultrasonic waves and detecting their reverberation.
Introductory Video
Cost-effecti©ve way to develop next-generation quantum devicesObservation of luminescence of the Si-vacancy defects created in a bulk SiC substrate
Research areas
- ・Magnetic sensing
- ・Temperature sensing
- ・Single-photon sources
![Observation of luminescence of the Si-vacancy defects created in a bulk SiC substrate](https://www.rohm.com/documents/11303/9279041/Si-vacancy_img.png/fff20179-19f6-536f-8a20-c75c6352f8ba?t=1624434386317)
Presented papers
The technology satisfying the competing operation of ultra-short pulse and high powerLD Module for LiDAR
Features
- ・Ultra-short pulse (<5ns) operation compatible with high laser power (100W to 200W)
- ・Surface mounting resin-mold package
- ・LD, FET, and capacitors integrated in a compact package
Applications
- ・Autonomous driving
- ・Range finding
- ・Industrial robots
Low-inductance design is the key for ultra short pulse high-power laser
![Low-inductance design is the key for ultra short pulse high-power laser](https://www.rohm.com/documents/11303/8124505/img_01.jpg/b01d89e1-6366-70c5-6f9e-b48ab5f52e50?t=1598509302607)
Development Roadmap
![Development Roadmap](https://www.rohm.com/documents/11303/8124505/img_02.jpg/2a5bbbeb-678a-c5eb-5a31-2c6b0fec9c17?t=1598509303057)
Typical characteristics of the LD module
![Typical characteristics of the LD module](https://www.rohm.com/documents/11303/8124505/img_03.jpg/12c8dd55-400a-68c7-2e14-a97aa8ae119e?t=1598509303277)
Circuit Diagram and Appearance
![Circuit Diagram and Appearance](https://www.rohm.com/documents/11303/8124505/img_04.jpg/eaf2a5c3-7087-a407-0b93-15ae08df3805?t=1598509303497)
Thermal conductivity hydrogen microsensor
Features
- ・Thermal conductivity sensor features long-term stability
- ・Improved accuracy in detecting hydrogen
- ・Low power consumption owning to MEMS technology
Applications
- ・Measurement of hydrogen content for a range of 0~100%
- ・Accurate detection of hydrogen leakage
- ・Measurement of contents other than hydrogen is also possible
![Comparison of hydrogen sensors](/documents/11303/12031100/teraheltz_b07.png/1c485975-8173-002b-3286-b6158d02200b?t=1714126569067)
MEMS Actuators and TransducersMEMS Devices Utilizing Thin-Film Piezo Technology
Research areas
- ・Conducted studies on high efficiency piezoelectric thin films
- ・Carried out R&D on electronic devices utilizing thin-film piezo technology
- ・Analyzed the operation and failure modes of piezo devices and implemented research into high reliability prediction technology based on the Finite Element Method (FEM)
![Piezoelectric Acoustic Sensor Loud Speaker and](https://www.rohm.com/documents/11303/8124475/img_01_2.jpg/ec7e61bb-cd00-27f4-e61a-7cf349c8f3db?t=1598575212987)
Piezoelectric Thin-Film Reliability Technology
![Piezoelectric Thin-Film Reliability Technology](https://www.rohm.com/documents/11303/8124475/img_02_2.jpg/9944002d-6649-e6e6-0d44-951a6d771d17?t=1598575213410)
AI
Automatic detection methodAgeing Monitoring of GaN Transistors using Recurrent Neural Networks
Research areas
- ・Reliability
- ・Machine learning
![Ageing Monitoring of GaN Transistors using Recurrent Neural Networks](https://www.rohm.com/documents/11303/9279034/img_ageing-monitoring.png/6c4b94b4-efcc-6637-09ef-f6e260b13973?t=1624434283270)
Introductory Video
Ageing Monitoring of GaN Transistors using Recurrent Neural Networks