NEWS & TOPICS
-
- 2025.05.30
-
Updated Presentations (Power Electronics: 1 case, Sensor Technology: 1 case)
Power Electronics
-
- Presentations
- 2025/05
Model-Based Cost-Benefit Analysis on Si/SiC Hybrid Switches for Traction Inverters
-
Sensor Technology
-
- Presentations
- 2025/03
Design of thin bandpass filter using microstrip lines on silicon substrate
- 2025.03.27
-
Updated Publications (Power Electronics: Publications 2 case)
Power Electronics
-
- Publications
- 2025/02
Optimizing the Number of Parallel SiC MOSFET Chips in a Wireless Power Transfer Inverter with Pulse Width Control - 2025/02
Increased high-temperature stiffness of an epoxy-based molding compound through high-temperature storage.
- 2025.02.26
-
Updated Presentations (Power Electronics: Presentations 1 case)
Power Electronics
-
- Presentations
- 2024/11
Experimental Validation of the Simulation Scheme Estimating the Freewheeling Transistor Surge Voltage During the Switching-Side One Turn-on Transient in a Half-Bridge Circuit
- 2025.01.22
-
Updated Presentations (Power Electronics: Presentations 3 case)
Power Electronics
-
- Presentations
- 2024/12
Remote epitaxy application for SiC wafer cost reduction - 2024/12
Effect of Growth Conditions on SiC Remote Epitaxy - 2024/12
Growth Control of Epitaxial Graphene and SiC Film for Remote Epitaxy
- 2024.12.24
-
Power Electronics
-
- Presentations
- 2024/11
A Common-Signal Driven Split Output Gate Driver for Si/SiC Hybrid Switches to Realize Zero-Voltage Switching
-
Sensor Technology
-
- Presentations
- 2024/11
In-situ measurement of the TCR of Pt for long-term stability of thermal conductivity hydrogen sensor
- 2024.11.15
-
Power Electronics
-
- Presentations
- 2024/09
Damage Parameter: Proposed Index to Quantify the Durability of Sintered Nano Silver and Multilayer Aluminum Foil Die Attach - 2024/09
Epoxy Molding Compounds Tensile Mechanical Property Changes Under High Temperature Exposure
-
Sensor Technology
-
- Presentations
- 2024/10
Temperature dependence of accuracy of thermal conductivity hydrogen sensor
- 2024.10.16
-
Power Electronics
-
- Publications
- 2024/09
Remote epitaxy and freestanding wide bandgap semiconductor membrane technology
- Presentations
- 2024/06
Large-area bonding with LMEE: Suppression of the degradation of the junction-to-water thermal resistance in power modules - 2024/09
Effect of Device Parameters of SiC MOSFETs on Turn-On Overvoltage across a Freewheeling Side in a Half Bridge Configuration
-
Others
-
- Presentations
- 2024/09
Resonant Tunnelling Diodes THz Oscillator: above room temperature characterization Rohm - 2024/09
Development of thin film piezoelectric resonator
- 2024.09.04
-
Updated Publications (Power Electronics: Publications 1 case)
Power Electronics
-
- Publications
- 2024/08
Mechanical Characterization of Sintered Silver Materials for Power Device Packaging: A Review
- 2024.08.08
-
Updated Presentations（Power Electronics: Presentations 3 case、Others: Presentations 2 case）
Power Electronics
-
- Presentations
- 2024/07
4H-SiC remote epitaxy for wafer cost reduction - 2024/07
Two-step growth of epitaxial graphene to suppress the in-process step bunching of SiC substrate - 2024/07
High C/Si Ratio Growth of 4H-SiC on Epitaxial Graphene/4H-SiC substrates
-
Others
-
- Presentations
- 2024/07
Structural verification of SiC remote epitaxial layers on the terrace using first-principles calculations - 2024/07
Adhesion strength evaluation of SiC remote epilayers exfoliation using density functional theory（DFT）
- 2024.07.19
-
Updated Publications(Power Electronics: Publications 1 case)
Power Electronics
-
- Publications
- 2024/06
Effect of the Conduction Resistance of SiC MOSFET on the Harmonics of Inverter Voltage in Wireless Power-Transfer Systems for Electric Vehicle
- 2024.06.17
-
Updated Publications(Sensor Technology: Publications 1 case)
Sensor Technology
-
- Publications
- 2024/05
Limiting current-type oxygen and humidity microsensor
- 2024.04.09
-
Others
-
- Presentations
- 2024/03
Electrical Characterization of Si capacitor with TSV electrode - 2024/03
Mode-dependent variations of eigenfrequencies in the one-dimensional Su–Schrieffer–Heeger electrical circuit: Experimental demonstration - 2024/03
Control of the morphology and the number of layers of graphene on SiC
-
Power Electronics
-
- Publications
- 2024/01
Fracture Mechanism of Sintered Silver Film Revealed by in-situ SEM Uniaxial Tensile Loading
-
- 2024.01.23
-
Updated Presentations(Sensor Technology: Presentations 1 case)
Sensor Technology
-
- Presentations
- 2023/12
Toward the Practical Application of Terahertz Resonant Tunneling Diodes
-
- 2023.12.11
-
Updated Publications(Sensor Technology: Publications 1 case)
Sensor Technology
-
- Publications
- 2023/10
Low-Power and Fast-Response Limiting Current-Type Oxygen Microsensor with a Wide Range Oxygen Concentration
-
- 2023.11.09
-
Updated Publications(Power Electronics: Publications 4 case)
Power Electronics
-
- Publications
- 2023/10
Development of In-Situ Measurement Method for Wire-Bonding Lifetime Utilizing the 4-terminal Method - 2023/10
Comparison of Sintered Silver Die Attach Failure between Thermal Shock Test and Mechanical Cycling Test - 2023/10
Degradation Mechanism of Silver Sintering Die Attach Based on Thermal and Mechanical Reliability Testing - 2023/10
Nine Point Bending Test Technique for Understanding of Sintered Silver Die Bonding Failure Mechanism
-
- 2023.09.26
-
Updated Publications & Presentations (Power Electronics: Publications 1 case / Presentations 3 case)
Power Electronics
-
- Publications
- 2023/09
The improved scheme of estimating embedded gate resistance to reproduce SiC MOSFET circuit performance
-
- Presentations
- 2023/08
Development of a high-speed and high-accuracy SiC MOSFET model applicable to circuit and system simulators - 2023/09
Effect of the Forward and Reverse Conduction Resistance of SiC MOSFET on the Harmonic Voltage of the Full-Bridge Inverters of Wireless Power Systems for Electric Vehicles and Its Suppression Method - 2023/09
Sputtered β-Ga2O3 Crystallization by High Temperature Annealing on AlN/Si
-
- 2023.08.09
-
Updated Publications & Presentations (Power Electronics: Presentations 1 case)
Power Electronics
-
- Presentations
- 2023/07
Application of remote epitaxy for SiC wafer cost reduction
- 2023.07.14
-
Updated Publications & Presentations (Power Electronics: Presentations 1 case)
Power Electronics
-
- Presentations
- 2023/06
Performance comparison between IGBT and SiC during WLTC
- 2023.06.15
-
Power Electronics
-
- Publications
- 2023/04
Performance Comparison of Si IGBT and SiC MOSFET Power Module driving IPMSM or IM under WLTC
-
- Presentations
- 2023/05
Conducted noise evaluation of Dual-Half Bridge PFC converter
-
Sensor Technology
-
- Presentations
- 2023/05
Characteristic Improvement of MEMS-type Ultrasonic Device with Controllable Natural Frequencies
- 2023.04.14
-
Power Electronics
-
- Presentations
- 2023/05
Degradation Mechanism of Sintered Silver Die Attach by Thermal and Mechanical Cycling test - 2023/05
Simplified Open-Loop Transfer Functions to Analyze Influential Parasitic Parameters for Oscillation Caused by Parallel Connected Transistors - 2023/06
Suppression of Leakage Current in Wireless Charging Systems Using N-legged Inverters
-
Sensor Technology
-
- Presentations
- 2023/06
EXTREMELY SMALL LIMITING-CURRENT-TYPE OXYGEN SENSOR WITH A WIDE RANGE PROPORTIONALITY OF THE OXYGEN CONCENTRATION
-
AI
-
- Presentations
- 2023/03
Structural optimization of Toroidal Coils based on Neural Network and Explainable AI
- 2023.03.16
-
Updated Publications & Presentations (AI: Presentations 2 cases)
AI
-
- Presentations
- 2023/03
Population estimation of characteristic variation in power transistors - 2023/06
Positioning analysis of semconductor companies for specidfic technology using BERT
- 2023.02.14
-
Power Electronics
-
- Publications
- 2022/12
Dominant Model-Parameter Determination for the Analysis of Current Imbalance Across Paralleled Power Transistors
- Presentations
- 2023/03
Enhancement of linear-polarization degree of emitted beam from photonic-crystal surface-emitting lasers (PCSELs) - 2023/05
A Unified Model of MIS and Ridge HEMTs for Fast and High-Power Switching Applications.
-
Sensor Technology
-
- Presentations
- 2023/03
Tolerance of eigenfrequencies in the Su-Schrieffer-Heeger electrical circuit
-
AI
-
- Presentations
- 2023/03
Proposal for a market investigation method based on time series analysis of multiple information resources written in natural language.
- 2023.01.10
-
Power Electronics
-
- Presentations
- 2023/05
Autonomous Minimization of Power Loss by Switching Frequency Adjusting Function for a DC–DC Converter
-
AI
-
- Presentations
- 2022/12
Principal Component Analysis based GaN transistor live health monitoring
- 2022.12.27
-
- NoMaDbot™ –No Map Driving Robot-
- 2022.12.12
-
Updated Publications & Presentations (Power Electronics: Presentations 2 cases)
Power Electronics
-
- Presentations
- 2022/12
A Secondary-Side Resonant LLC converter for Reducing Resonance Voltage with Boost Mode Operation Using Resonance Including Current Doubler Rectifier - 2022/12
Research on the correlation between power devices and power systems
- 2022.11.09
-
Updated Publications & Presentations (Power Electronics: Presentations 3 cases)
Power Electronics
-
- Presentations
- 2022/11
Nine Point Bending Test Technique for Evaluating the Sintered Silver Die Degradation - 2022/12
Sintered Silver Degradation Assessment by Thermal and Mechanical Cyclic Tests - 2023/01
SiC wafer cost reduction with remote epitaxy technology
- 2022.09.08
-
Power Electronics
-
- Presentations
- Sintered Silver Die Degradation Evaluation by Nine Point Bending Test Technique
- Control of current distribution for enhanced robustness of single-mode oscillation in a photonic-crystal surface-emitting laser
- Evaluating Sintered Silver Die-attach Thermal Cycling Degradation
- Degradation Mechanism Comparison of Sintered Silver Die in Thermal and Mechanical Cycling Tests
-
Sensor Technology
-
- Presentations
- THz imaging system with a single resonant tunneling diode transceiver in the 300-GHz band
- Size Reduction in Imaging System Using a Single Resonant Tunneling Diode Transceiver
- 2022.08.26
-
Power Electronics
-
- Publications
- Evaluation of Thermal Couple Impedance Model of Power Modules for Accurate Die Temperature Estimation up to 200℃
- An evaluation of a new type of High Efficiency Hybrid Gate Drive Circuit for SiC- MOSFET suitable for Automotive Power Electronics System Applications
-
- Presentations
- Auto Structural Optimization of Toroidal Coils Based on Neural Network and Genetic Algorithm
- LPCVD SiN Film Breakdown and N2-anneal Temperature (Ⅰ) TDDB and ESR Evaluations
- LPCVD SiN Film Breakdown and N2-anneal Temperature (Ⅱ) ESR and FTIR Evaluations
- Effect of N2-Anneal Temperature on Silicon Nitride film:(Ⅰ) Time-Dependent Dielectric Breakdown and ESR Evaluations
- Effect of N2-Anneal Temperature on Silicon Nitride film:(Ⅱ) Fine Structures of ESR Spectrum and FTIR
- Effects of Underside-Si Annealing on Charge Breakdown of LPCVD SiN Film
-
Sensor Technology
-
- Presentations
- Oxygen and humidity sensing property of a limiting current-type thin-film YSZ-based sensor on a micro-hotplate
- Compact and cost-effective solution for terahertz applications