ROHM Product Detail

ML22Q666-NNNGD(Taping)
Internal Flash Memory Type

Lapis

The ML226xx series is speech synthesis LSI with 4Mbit to 32Mbit flash memory.
The large capacity memory is ideal for long audio playback such as voice guidance. Flash memory allows easy rewriting of audio data,  it also has a function to rewrite sound data from the MCU.
The HQ-ADPCM, 16-bit D / A converter, and low-pass filter that achieve high sound quality are adopted, and a 1.0W monaural speaker amplifier for directly driving speakers is built-in.
Since the functions required for audio output are integrated on a single chip, audio functions can be easily realized simply by adding this LSI.

Data Sheet Buy Sample
Data Sheet Buy

Product Detail

 
Part Number | ML22Q666-NNNGDZ05BX
Status | Recommended
Package | P-WQFN32-0505-0.50-A63-MC
Packing Type | Taping
Unit Quantity | 1000
Minimum Package Quantity | 1000
RoHS | Yes

Specifications:

Operating Voltage [V]

2.7 to 3.6 or 3.3 to 5.5

Operating Frequency [MHz]

4.096
4.000

Oscillator

Built-in
External

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

70

ROM Capacity [bit]

Flash
32M

Number of Phrases ?

4096

Maximum Playback Time ?

27min *1

CPU I/F

I2C

SP Amplifier Output [W] / Class

1.0/AB-class,
D-class

Number of Mixing (Internal) [ch]

4

Others

Failure detection

Automotive Grade

No

AEC-Q100 standard

No

Industrial Grade

Yes

Find Similar

Development Support

 
    • Reference Board
    • RB-S22Q66xTB32

    • Supply Status
      Recommended
      Supporuted LSI
      • ML22Q663
      • ML22Q664
      • ML22Q665
      • ML22Q666
      Composition
      • Reference board with TQFP32 socket
      • User's Manual
      Notes
      • Used by connecting to SDCB3.

  • User's Guide Buy
    • Reference Board
    • RB-S22Q66xGD32

    • Supply Status
      Recommended
      Supporuted LSI
      • ML22Q663
      • ML22Q664
      • ML22Q665
      • ML22Q666
      Composition
      • Reference board with WQFN32 socket
      • User's Manual
      Notes
      • Used by connecting to SDCB3.

  • User's Guide Purchase Inquiry
    • Development Kit
    • SDCK3

    • Supply Status
      Recommended
      Supporuted LSI
      • ML22530, Q532, Q533, Q535
      • ML22620, Q623, Q624, Q625, Q626
      • ML22660, Q663, Q664, Q665, Q666
      • ML22Q234, Q244, Q254
      • ML22Q274, Q284, Q294
      • ML22572, 573, Q573, Q553, ML22594
      • ML22Q374, Q394
      • ML22562, 563, Q563
      • ML22823, 824, 825
      • ML22863, 864, 865
      Composition
      • Sound device control board 3 [SDCB3]
      • USB cable

  • User's Guide Buy

"LAPIS TECHNOLOGY™" is a trademark or a registered trademark of ROHM Co., Ltd.

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