PNP+PNP, SOT-553, Dual Digital Transistor (Bias Resistor Built-in Transistor)

Devices integrating two transistors are available in ultra-compact packages, suitable for various applications such as pre-amplifier differential amplification circuits, high-frequency oscillators, driver ICs and so forth.

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Product Detail

Part Number | EMA4T2R
Status | Recommended
Package | EMT5
Unit Quantity | 8000
Minimum Package Quantity | 8000
Packing Type | Taping
RoHS | Yes




Package Code


Package Size [mm]

1.6x1.6 (t=0.55)

JEITA Package


Number of terminal




Supply voltage VCC 1[V]


Collector current Io (Ic) [A]


Input resistance R1 1 [kΩ]


Input resistance R1 2 [kΩ]


Collector-Emitter voltage VCEO1[V]


Collector current Io(Ic) [A]


Collector-Emitter voltage VCEO2[V]


Collector current(continuous) IC2[A]


Power Dissipation (PD)[W]


Mounting Style

Surface mount

Equivalent (Single Part)

DTA114T / DTA114T

Storage Temperature (Min.)[°C]


Storage Temperature (Max.)[°C]



· Ultra-compact complex digital transistor
· Input resistor type
· Small Surface Mount Package
· Pb Free/RoHS Compliant

Design Resources


Technical Articles

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • What is a Thermal Model? (Transistor)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple



  • EMA4 SPICE Model
  • EMA4 Thermal Model (lib)
  • How to Create Symbols for PSpice Models


  • EMT5 3D STEP Data

Characteristics Data

  • ESD Data

Packaging & Quality

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations