DTDG14GP
NPN, SOT-89, R2 Alone Type Digital Transistor (Bias Resistor Built-in Transistor)

These are the standard products of "digital transistors" which ROHM invented and marketed first in the world.

Data Sheet Buy Sample
* This is a standard-grade product.
For Automotive usage, please contact Sales.
Data Sheet Buy Sample

Product Detail

 
Part Number | DTDG14GPT100
Status | Active
Package | MPT3
Unit Quantity | 1000
Minimum Package Quantity | 1000
Packing Type | Taping
RoHS | Yes

Specifications:

Grade

Standard

Package Code

SOT-89

JEITA Package

SC-62

Package Size[mm]

4.5x4.0 (t=1.5)

Number of terminal

3

Polarity

NPN

Supply voltage VCC 1[V]

60.0

Collector current Io (Ic) [A]

1.0

Emitter base Resistance R2 1 [kΩ]

10.0

Collector-Emitter voltage VCEO1[V]

60.0

Collector current Io(Ic) [A]

1.0

Power Dissipation (PD)[W]

0.5

Mounting Style

Surface mount

GI hFE

300 to

Output Current [A]

1.0

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Features:

· Standard digital transistor
· Built-In Biasing Resistors
· Small Surface Mount Package
· Pb Free/RoHS Compliant

Design Resources

 

Documents

Application Note

  • How to Create Symbols for PSpice Models

Technical Articles

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • What is a Thermal Model? (Transistor)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Models

  • DTDG14GP SPICE Model

Characteristics Data

  • DTDG14GP Thermal Resistance

Packaging & Quality

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List - Please contact us by filling in the form.
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations