EMX1
NPN+NPN, SOT-563, General Purpose Amplification Transistor

Devices integrating two transistors are available in ultra-compact packages, suitable for various applications such as pre-amplifier differential amplification circuits, high-frequency oscillators, driver ICs and so forth.

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Product Detail

 
Part Number | EMX1T2R
Status | Recommended
Package | EMT6
Unit Quantity | 8000
Minimum Package Quantity | 8000
Packing Type | Taping
RoHS | Yes

Specifications:

Grade

Standard

Package Code

SOT-563

JEITA Package

SC-107C

Package Size[mm]

1.6x1.6 (t=0.5)

Number of terminal

6

Polarity

NPN+NPN

Collector-Emitter voltage VCEO1[V]

50.0

Collector current Io(Ic) [A]

0.15

Collector-Emitter voltage VCEO2[V]

50.0

Collector current(continuous) IC2[A]

0.15

hFE

120 to

hFE (Min.)

120

Mounting Style

Surface mount

Equivalent (Single Part)

2SC2412K / 2SC2412K

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Features:

· Ultra-compact complex bipolar transistor
· For pre-amplifier
· Small Surface Mount Package
· Pb Free/RoHS Compliant
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Design Resources

 

Technical Articles

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Transistor)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Simulations (Login Required)

  • Method for Exporting Circuit Data (ROHM Solution Simulator)

Models

  • EMX1 SPICE Model
  • EMX1 Thermal Model (lib)

2D/3D/CAD

  • EMT6 STEP Data

Characteristics Data

  • ESD Data

Packaging & Quality

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List - Please contact us by filling in the form.
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations