Not Recommended for New Designs SCS310AP
Silicon carbide Schottky Barrier Diode

This product cannot be used for new designs (Not recommended for design diversion).

Product Detail


Replacement Product For SCS310AP

Part Number
Ordering Part Number SCS310APC9 SCS310AHGC9
Similar Level - Same Pinout, Package
Data Sheet    
Supply Status Not Recommended for New Designs Recommended
Package TO-220ACP TO-220ACP
Unit Quantity 1000 1000
Minimum Packing Quantity 50 50
Packing Type Tube Tube
RoHS Yes Yes
Package Size [mm] 10.2x15.6 (t=4.7) 10.2x15.6 (t=4.7)
Reverse Voltage[V] 650 650
Continuous Forward Current[A] 10.0 10.0
Total Power Dissipation[W] 71 71
Junction Temperature (Max.) [°C] 175 175
Storage Temperature (Min.)[°C] -55 -55
Storage Temperature (Max.)[°C] 175 175

Design Resources



White Paper

  • Cutting-Edge Web Simulation Tool “ROHM Solution Simulator” Capable of Complete Circuit Verification of Power Devices and Driver ICs

Technical Articles

Schematic Design & Verification

  • [NEW]Application Note for SiC Power Devices and Modules
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • What is a Thermal Model? (SiC Power Device)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • How to Use Thermal Models
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple



  • Circuit Data: DC-DC Boost Converter 2P-Interleave Pin=5kW
  • Circuit Data: For SCS310AP device evaluation
  • SCS310AP SPICE Model
  • SCS310AP Thermal Model (lib)
  • How to Create Symbols for PSpice Models

Characteristics Data

  • ESD Data

Packaging & Quality

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • Compliance of the ELV directive
  • Report of SVHC under REACH Regulation

Export Information

  • About Export Administration Regulations (EAR)