BSM180C12P2E202

1200V, 204A, Chopper, Silicon-carbide (SiC) Power Module

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BSM180C12P2E202

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BSM180C12P2E202
1200V, 204A, Chopper, Silicon-carbide (SiC) Power Module

BSM180C12P2E202 is a SiC (silicon carbide) power module with low surge and low switching loss, suitable for converter, photovoltaics, wind power generation, heating equipment.

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* This is a standard-grade product.
For Automotive usage, please contact Sales.

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Product Detail

Part Number | BSM180C12P2E202

Status | Recommended

Package | E Type

Packing Type | Corrugated Cardboard

Unit Quantity | 4

Minimum Package Quantity | 4

RoHS | Yes

Specifications:

Drain-source Voltage[V]

1200

Drain Current[A]

204

Total Power Dissipation[W]

1360

Junction Temperature (Max.) [℃]

175

Storage Temperature (Min.) [℃]

-40

Storage Temperature (Max.) [℃]

125

Package

Chopper

Package Size [mm]

152.0x62.0 (t=18.0)

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Features:

Low surge, low switching loss.
High-speed switching possible.
Reduced temperature dependance.

Reference Design / Application Evaluation Kit

Drive Board - BSMGD2G12D24-EVK001
This evaluation board, BSMGD2G12D24-EVK001, is a gate driver board for full SiC Modules with the 2^nd Generation SiC-MOSFET in G and E type housing. This evaluation board contains all the necessary components for optimal and safety driving the SiC module

User's Guide

Snubber Module - MGSM1D72J2-145MH16
Snubber Module for BSM series (1200V, E / G type)

Design Resources

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Documents

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Type	Title	Last Updated
Data Sheet	BSM180C12P2E202 Data Sheet	2017/12/14
User's Guide	Evaluation Board User's Guide	2024/10/09
Application Note	How to Suppress the Parallel Drive Oscillation in SiC Modules	2024/08/27
Application Note	Part Explanation	2024/08/02

Title	Description
No data available in table

Technical Articles

Search:

Type	Title	Last Updated
Technical Article	Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)	2025/04/16
Schematic Design & Verification	How to Use LTspice® Models	2025/03/06
White Paper	Power Eco Family: Overview of ROHM's Power Semiconductor Lineup	2025/02/26
Technical Article	How to measure the oscillation occurs between parallel-connected devices	2025/01/15
Technical Article	Notes on Gate Drive Voltage Setting and Linear Mode Application of SiC MOSFET	2024/10/16
Technical Article	Simulation Verification to Identify Oscillation between Parallel Dies during Design Phase of Power Modules	2024/10/01
Thermal Design	Thermal Resistance Measurement Method for SiC MOSFET	2024/09/27
Schematic Design & Verification	How to Use PSIM Models	2024/08/27
Technical Article	How to Use PLECS Models	2024/08/08
Schematic Design & Verification	Method for Monitoring Switching Waveform	2024/06/04
Schematic Design & Verification	Oscillation countermeasures for MOSFETs in parallel	2023/12/19
Thermal Design	Judgment Criteria of Thermal Evaluation	2023/03/08
Thermal Design	How to Use the Thermal Resistance and Thermal Characteristics Parameters	2023/02/24
Thermal Design	θ_JA and Ψ_JT	2023/02/13
Thermal Design	θ_JC and Ψ_JT	2023/01/20
Schematic Design & Verification	How to Use LTspice® Models: Tips for Improving Convergence	2023/01/11
Thermal Design	Precautions for Thermal Resistance of Insulation Sheet	2022/10/11
Thermal Design	Measurement Method and Usage of Thermal Resistance RthJC	2022/09/15
Thermal Design	PCB Layout Thermal Design Guide	2022/07/12
Thermal Design	Notes for Calculating Power Consumption:Static Operation	2022/07/06
White Paper	Cutting-Edge Web Simulation Tool “ROHM Solution Simulator” Capable of Complete Circuit Verification of Power Devices and Driver ICs	2022/03/11
White Paper	4 Steps for Successful Thermal Designing of Power Devices	2022/03/07
Thermal Design	Basics of Thermal Resistance and Heat Dissipation	2021/08/18
Thermal Design	What Is Thermal Design	2021/06/24
Thermal Design	Method for Calculating Junction Temperature from Transient Thermal Resistance Data	2021/06/14
Thermal Design	Optimized heat sink assembly method for effective heat dissipation	2021/01/07
Schematic Design & Verification	Application Note for SiC Power Devices and Modules	2020/12/15
Schematic Design & Verification	Importance of Probe Calibration When Measuring Power: Deskew	2020/12/07
Thermal Design	Precautions When Measuring the Rear of the Package with a Thermocouple	2020/10/26
Schematic Design & Verification	Impedance Characteristics of Bypass Capacitor	2020/09/16
Schematic Design & Verification	Calculation of Power Dissipation in Switching Circuit	2020/07/31
Thermal Design	Notes for Temperature Measurement Using Forward Voltage of PN Junction	2020/04/20
Thermal Design	Notes for Temperature Measurement Using Thermocouples	2020/04/09
Thermal Design	How to Use Thermal Models	2020/02/18
Thermal Design	What is a Thermal Model? (SiC Power Device)	2019/12/27

Type	Title	Last Updated
No data available in table

Tools

Search:

Type	Title	Last Updated
Models	How to Create Symbols for PSpice Models	2021/06/02
Models	Power Module Loss Simulator - Boost Converter	2020/08/05
Models	BSM180C12P2E202 SPICE Simulation Evaluation Circuit	2018/09/18
Models	BSM180C12P2E202 SPICE Thermal Model	2018/09/03
Models	BSM180C12P2E202 SPICE Model	2018/09/03
Models	BSM180C12P2E202 PLECS Model	2017/08/10

Type	Title	Last Updated
Export Information	About Export Regulations	2016/09/28
Environmental Data	Compliance of the ELV directive	2016/09/28

BSM180C12P2E202

BSM180C12P2E202
1200V, 204A, Chopper, Silicon-carbide (SiC) Power Module

Product Detail

Specifications:

Features:

Reference Design / Application Evaluation Kit

Design Resources

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Technical Articles

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