BD63860EFV - Documentation

BD63860EFV has the 3-bit DAC, and is designed to operate bipolar stepper motors in eighth-step modes. As for its basic function, it is a low power consumption bipolar PWM constant current-drive driver with power supply's rated voltage of 36V and rated output current of 2.5A peak. For the input interface, the CLK-IN drive mode. There are excitation modes of FULL STEP, HALF STEP, QUATER STEP and EIGHTH STEP mode, and for current decay mode, the ratio of FAST DECAY & SLOW DECAY can be freely set, so the optimum control conditions for every motor can be realized. In addition, being able to drive with one system of power supply makes contribution to the set design's getting easy.

* This is a standard-grade product.
For Automotive usage, please contact Sales.

User's Guide

RAGU User's Guide (EN)
 
The RAGU is Evaluation Tool controls the stepping motor driver IC to demonstrate and evaluate its functions.

Application Note

Notes for Temperature Measurement Using Thermocouples
 
This application note explains cautions regarding the temperature measurement. The content of this application note is generally applicable, irrespective of the types of semiconductor devices.
Two-Resistor Model for Thermal Simulation
 
This application note explains the two-resistor model, which is the simplest model among thermal models used in thermal simulations. The thermal simulations mentioned three-dimensional model thermal conduction and thermal fluid analysis tools.
Notes for Temperature Measurement Using Forward Voltage of PN Junction
 
This application note explains cautions regarding the temperature measurement Using Forward Voltage of PN Junction. The content of this application note is generally applicable, irrespective of the types of semiconductor devices.
Method for Monitoring Switching Waveform
 
This application note explains how to correctly monitor the switching waveforms of the power device element such as switching power supply or a motor drive circuit.
Thermal Resistance
 
The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.
Part Explanation
 
For ICs