BD6225FP
18V Max. H-bridge Drivers

ROHM offers a wide lineup of H-bridge drivers in different supply voltages (7V/18V/36V) and output currents (0.5A/1A/2A) to meet the needs of a variety of applications. Our standard products also contain a VREF variable function that contributes to lower power consumption and greater efficiency. In addition, multiple built-in protection circuits (i.e. thermal shutdown, overcurrent, overvoltage) protect the IC and load from damage while ensuring a high degree of reliability.

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* This is a standard-grade product.
For Automotive usage, please contact Sales.
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Product Detail

 
Part Number | BD6225FP-E2
Status | Recommended
Package | HSOP25
Unit Quantity | 2000
Minimum Package Quantity | 2000
Packing Type | Taping
RoHS | Yes

Specifications:

Grade

Standard

Vcc (Max.)[V]

18.0

Power Supply Voltage (Max.) [V]

15.0

Power Supply Voltage (Min.) [V]

6.0

Iout (Max.)[A]

0.5

Output On Resistance (Typ.)[Ω]

1.5

Number of Motors

2.0

VREF・PWM

Yes

Current Limit

-

High Speed Drive

-

Automotive class

No

Operating Temperature (Min.)[°C]

-25

Operating Temperature (Max.)[°C]

85

Package Size [mm]

13.6x7.8(t=2.11)

Features:

・Low standby current
・Compatible with PWM control signal input (20k to 100kHz)
・PWM duty control via VREF voltage setting terminal
・Cross-conduction prevention circuit
・Four protection circuits provided: OCP, OVP, TSD and UVLO
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Design Resources

 

Documents

Application Note

  • BD62xx Series

Technical Articles

Schematic Design & Verification

  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • Thermal Resistance
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

2D/3D/CAD

  • HSOP25 Footprint / Symbol

Packaging & Quality

Package Information

  • Package Information
  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Contained Report
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)