BD67173NUX - Documentation
BD67173NUX is a three-phase sensor less fan motor driver used to cool off notebook PCs. It is controlled by a variable speed provided through the PWM input signal. Its feature is sensor less drive which doesn’t require a hall device as a location detection sensor and motor downsizing can be achieved by limiting the number of external components as much as possible. Furthermore, introducing a direct PWM soft switched driving mechanism achieves silent operations and low vibrations.
×
Application Note
|
Notes for Temperature Measurement Using Thermocouples
|
|
This application note explains cautions regarding the temperature measurement. The content of this application note is generally applicable, irrespective of the types of semiconductor devices.
|
|
Two-Resistor Model for Thermal Simulation
|
|
This application note explains the two-resistor model, which is the simplest model among thermal models used in thermal simulations. The thermal simulations mentioned three-dimensional model thermal conduction and thermal fluid analysis tools.
|
|
Notes for Temperature Measurement Using Forward Voltage of PN Junction
|
|
This application note explains cautions regarding the temperature measurement Using Forward Voltage of PN Junction. The content of this application note is generally applicable, irrespective of the types of semiconductor devices.
|
|
Method for Monitoring Switching Waveform
|
|
This application note explains how to correctly monitor the switching waveforms of the power device element such as switching power supply or a motor drive circuit.
|
|
Importance of Probe Calibration When Measuring Power: Deskew
|
|
Even when devices used for measurement are calibrated regularly, they will give incorrect results if calibration is not perfo rmed for the measurement environment. This application note explains the importance of probe calibration in power measurement environments.
|
|
Thermal Resistance
|
|
The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.
|
|
Impedance Characteristics of Bypass Capacitor
|
|
This application note focuses on the impedance characteristics of capacitors, and explains cautions for selecting bypass capacitors.
|
|
Precautions When Measuring the Rear of the Package with a Thermocouple
|
|
This application note describes precautions when measuring the temperature on the rear of a package using a thermocouple to find the junction temperature of a semiconductor chip during actual operation.
|
|
Package Ordering Unit
|
|
For ICs
|