RF4C050AP
Pch -20V -10A Middle Power MOSFET

The high power small mold package RF4C050AP is suitable for switching and load switch.

Data Sheet Buy * Sample *
* This is a standard-grade product.
For Automotive usage, please contact Sales.

Product Detail

 
Part Number | RF4C050APTR
Status | Recommended
Package | HUML2020L8 (Single)
Unit Quantity | 3000
Minimum Package Quantity | 3000
Packing Type | Taping
RoHS | Yes

Specifications:

Grade

Standard

Package Code

DFN2020-8S

Package Size [mm]

2.0x2.0 (t=0.6)

Applications

Switching

Number of terminal

8

Polarity

Pch

Drain-Source Voltage VDSS[V]

-20

Drain Current ID[A]

-10.0

RDS(on)[Ω] VGS=1.5V(Typ.)

0.032

RDS(on)[Ω] VGS=2.5V(Typ.)

0.022

RDS(on)[Ω] VGS=4.5V(Typ.)

0.018

RDS(on)[Ω] VGS=Drive (Typ.)

0.032

Total gate charge Qg[nC]

55.0

Power Dissipation (PD)[W]

2.0

Drive Voltage[V]

-1.5

Mounting Style

Surface mount

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Features:

・ Low on - resistance.
・ High Power Small Mold Package (HUML2020L8).
・ Pb-free lead plating ; RoHS compliant
・ Halogen Free

Design Resources

 

Technical Articles

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Transistor)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Models

  • RF4C050AP SPICE Model
  • RF4C050AP Thermal Model (lib)
  • How to Create Symbols for PSpice Models

Characteristics Data

  • ESD Data

Packaging & Quality

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Condition of Soldering
  • Moisture Sensitivity Level
  • Anti-Whisker formation

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations