RD3G01BAT (New)
Pch -40V -15A Power MOSFET

RD3G01BAT is a low on-resistance power MOSFET suitable for switching applications.

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Product Detail

 
Part Number | RD3G01BATTL1
Status | Recommended
Package | TO-252
Unit Quantity | 2500
Minimum Package Quantity | 2500
Packing Type | Taping
RoHS | Yes

Specifications:

Grade

Standard

Package Code

TO-252 (DPAK)

Package Size [mm]

6.6x9.9 (t=2.4)

JEITA Package

SC-63

Number of terminal

3

Polarity

Pch

Drain-Source Voltage VDSS[V]

-40

Drain Current ID[A]

-15.0

RDS(on)[Ω] VGS=4.5V(Typ.)

0.038

RDS(on)[Ω] VGS=10V(Typ.)

0.031

RDS(on)[Ω] VGS=Drive (Typ.)

0.038

Total gate charge Qg[nC]

9.5

Power Dissipation (PD)[W]

25.0

Drive Voltage[V]

-4.5

Mounting Style

Surface mount

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Features:

  • Low on - resistance
  • Fast switching speed
  • Drive circuits can be simple
  • Parallel use is easy
  • Pb-free plating ; RoHS compliant

Design Resources

 

Technical Articles

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • What is a Thermal Model? (Transistor)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Models

  • How to Create Symbols for PSpice Models
  • RD3G01BAT SPICE Model
  • RD3G01BAT Thermal Model

Characteristics Data

  • RD3G01BAT ESD Data

Packaging & Quality

Package Information

  • Package Dimensions
  • Explanation for Marking
  • Condition of Soldering
  • Moisture Sensitivity Level
  • Anti-Whisker formation

Environmental Data

  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations