RE1J002YN
0.9V Drive Nch MOSFET

MOSFETs are made as ultra-low ON-resistance by the micro-processing technologies suitable for mobile equipment for low current consumption. In wide lineup including compact type, high-power type and complex type to meet in the market.

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Product Detail

 
Part Number | RE1J002YNTCL
Status | Active
Package | EMT3F
Unit Quantity | 3000
Minimum Package Quantity | 3000
Packing Type | Taping
RoHS | Yes

Specifications:

Grade

Standard

Package Code

SOT-416FL

Package Size [mm]

1.6x1.6 (t=0.85)

JEITA Package

SC-89

Number of terminal

3

Polarity

Nch

Drain-Source Voltage VDSS[V]

50

Drain Current ID[A]

0.2

RDS(on)[Ω] VGS=0.9V(Typ.)

3.0

RDS(on)[Ω] VGS=1.2V(Typ.)

2.2

RDS(on)[Ω] VGS=1.5V(Typ.)

2.0

RDS(on)[Ω] VGS=2.5V(Typ.)

1.7

RDS(on)[Ω] VGS=4.5V(Typ.)

1.6

RDS(on)[Ω] VGS=Drive (Typ.)

3.0

Power Dissipation (PD)[W]

0.15

Drive Voltage[V]

0.9

Mounting Style

Surface mount

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Features:

· Low voltage(0.9V) drive type
· Nch Small-signal MOSFET
· Small Surface Mount Package
· Pb Free/RoHS Compliant
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Design Resources

 

Technical Articles

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Transistor)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Models

  • RE1J002YN SPICE Model
  • RE1J002YN Thermal Model (lib)
  • How to Create Symbols for PSpice Models

2D/3D/CAD

  • EMT3F STEP Data

Characteristics Data

  • ESD Data

Packaging & Quality

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Condition of Soldering
  • Moisture Sensitivity Level
  • Anti-Whisker formation

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations