RA1C030LD (New)
Nch 20V 3.0A, SMM1006, WLCSP MOSFET

RA1C030LD is a WLCSP MOSFET with low-on resistance and High power package, suitable for Switching circuits, Single-Cell Battery Applications, Mobile Applications.

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* This is a standard-grade product.
For Automotive usage, please contact Sales.

Product Detail

 
Part Number | RA1C030LDT5CL
Status | Recommended
Package | SMM1006
Unit Quantity | 15000
Minimum Package Quantity | 15000
Packing Type | Taping
RoHS | Yes

Specifications:

Applications

Switching

Number of terminal

3

Polarity

Nch

Drain-Source Voltage VDSS[V]

20

Drain Current ID[A]

0.14

RDS(on)[Ω] VGS=1.8V(Typ.)

0.2

RDS(on)[Ω] VGS=2.5V(Typ.)

0.13

RDS(on)[Ω] VGS=4.5V(Typ.)

0.08

RDS(on)[Ω] VGS=Drive (Typ.)

0.2

Total gate charge Qg[nC]

1.5

Power Dissipation (PD)[W]

1

Drive Voltage[V]

1.8

Mounting Style

Surface mount

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Package Size [mm]

0.6x1 (t=0.25)

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Features:

  • Low on - resistance.
  • High Power small Package.
  • Pb-free lead plating ; RoHS compliant.
  • Halogen Free.
  • ESD protection up to 200V (MM).
    up to 2kV (HBM).
  • WLCSP (Wafer level chip size package)

Supporting Information

 

Overview

The RA1C030LD is offered in the DSN1006-3 wafer-level, chip-size package (1.0mm × 0.6mm) that takes advantage of ROHM’s proprietary IC process to achieve low power dissipation together with greater miniaturization. In terms of the figure of merit that expresses the relationship between conduction and switching losses (ON-resistance × Qgd), an industry-leading value has been achieved that is 20% lower than standard package products in the same package (1.0mm × 0.6mm or smaller), contributing to a significantly smaller board area along with higher efficiency in a variety of compact devices. At the same time, ROHM’s unique package structure provides insulated protection for the side walls (unlike standard products in the same package with no protection). This reduces the risk of shorts due to contact between components in compact devices that must resort to high density mounting due to space constraints, contributing to safer operation.

Power Loss Comparison: RA1C030LD vs Standard Products
Package Comparison: RA1C030LD vs Standard Package

Application Examples

  • ◇ Hearables (i.e. wireless earbuds)
  • ◇ Wearables such as smart watches, smart glasses, and action cameras
  • ◇ Smartphones
    Also suitable for switching in a wide range of thin, compact devices.