QS5U28
2.5V Drive Pch+SBD MOSFET

ROHM MOSFETs are made as low RDS(on) resistance devices utilizing the micro-processing technologies and available in wide lineup including hybrid types (MOSFET + Schottky Barrier Diode) to meet various needs in the market.

Data Sheet Buy * Sample *
* This is a standard-grade product.
For Automotive usage, please contact Sales.

Product Detail

 
Part Number | QS5U28TR
Status | Recommended
Package | TSMT5
Unit Quantity | 3000
Minimum Package Quantity | 3000
Packing Type | Taping
RoHS | Yes

Specifications:

Grade

Standard

Package Code

SOT-25T

Package Size[mm]

2.9x2.8 (t=1.0)

Number of terminal

5

Polarity

Pch+Schottky

Drain-Source Voltage VDSS[V]

-20

Drain Current ID[A]

-2.0

RDS(on)[Ω] VGS=2.5V(Typ.)

0.175

RDS(on)[Ω] VGS=4V(Typ.)

0.097

RDS(on)[Ω] VGS=4.5V(Typ.)

0.09

RDS(on)[Ω] VGS=Drive (Typ.)

0.175

Total gate charge Qg[nC]

4.8

Power Dissipation (PD)[W]

0.9

Drive Voltage[V]

-2.5

Reverse voltage VR (Diode) [V]

20.0

Forward Current IF (Diode) [A]

1.0

Forward Current Surge Peak IFSM (Diode) [A]

3.0

Mounting Style

Surface mount

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Features:

· Multiple Schottky Barrier Diodes Middle Power MOSFET
· Small Surface Mount Package
· Pb Free/RoHS Compliant

Design Resources

 

Documents

Application Note

  • How to Create Symbols for PSpice Models

Technical Articles

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Transistor)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Models

  • QS5U28 SPICE Model
  • QS5U28 Thermal Model (lib)

Characteristics Data

  • ESD Data

Packaging & Quality

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Condition of Soldering
  • Moisture Sensitivity Level
  • Anti-Whisker formation

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List - Please contact us by filling in the form.
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations