BR25H320FVT-2C
Automotive 125℃ Operation SPI BUS 32kbit (4096x8bit) EEPROM

BR25H320-2C is a serial EEPROM of SPI BUS interface method.

Product Detail

 
Part Number | BR25H320FVT-2CE2
Status | Recommended
Package | TSSOP-B8
Unit Quantity | 3000
Minimum Package Quantity | 3000
Packing Type | Taping
RoHS | Yes
Functional Safety | FS supportive

Specifications:

Series

BR25H-2C

Grade

Automotive

I/F

SPI BUS

Density [bit]

32k

Bit Format [Word x Bit]

4k x 8

Package

TSSOP-B8

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

125

Vcc(Min.)[V]

2.5

Vcc(Max.)[V]

5.5

Circuit Current (Max.)[mA]

4.0

Standby Current (Max.)[μA]

10.0

Write Cycle (Max.)[ms]

4.0

Input Frequency (Max.)[Hz]

10M

Endurance (Max.)[Cycle]

106

Data Retention (Max.)[Year]

100

Features:

・High speed clock action up to 10MHz (Max.)
・Wait function by HOLDB terminal.
・Part or whole of memory arrays settable as read only
memory area by program.
・2.5~5.5V single power source action most suitable
for battery use.
・Page write mode useful for initial value write at
factory shipment.
・For SPI bus interface (CPOL, CPHA)=(0, 0), (1, 1)
・Self-timed programming cycle.
・Low Supply Current
At Write Operation (5V) : 1.0mA (Typ.)
At Read Operation (5V) : 1.0mA (Typ.)
At Standby Operation (5V) : 0.1μA (Typ.)
・Address auto increment function at read operation
・Prevention of write mistake
Write prohibition at power on.
Write prohibition by command code (WRDI).
Write prohibition by WPB pin.
Write prohibition block setting by status registers
(BP1, BP0).
Write mistake prevention function at low voltage.
・MSOP8, TSSOP-B8, SOP8, SOP-J8 Package
・Data at shipment Memory array: FFh, status register
WPEN, BP1, BP0 : 0
・Data kept for 50 years (Ta≦125℃).
・Data rewrite up to 300,000 times (Ta≦125℃).
・AEC-Q100 Qualified.

Design Resources

 

Documents

Application Note

  • Difference between BR25H-2C, BR25H-W(C) and BR35H-WC

Technical Articles

Schematic Design & Verification

  • Opcode, Address, and Page Configuration for SPI BUS EEPROM
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Thermal Resistance

Tools

2D/3D/CAD

  • TSSOP-B8 Footprint / Symbol

Packaging & Quality

Package Information

  • Package Information
  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)