BR25H040FVT-2C
Automotive SPI BUS 4kbit(512x8bit) EEPROM

BR25H040-2C is a serial EEPROM of SPI BUS interface method.

Product Detail

 
Part Number | BR25H040FVT-2CE2
Status | Recommended
Package | TSSOP-B8
Unit Quantity | 3000
Minimum Package Quantity | 3000
Packing Type | Taping
RoHS | Yes
Functional Safety | FS supportive

Specifications:

Series

BR25H-2C

Grade

Automotive

I/F

SPI BUS

Density [bit]

4k

Bit Format [Word x Bit]

512 x 8

Package

TSSOP-B8

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

125

Vcc(Min.)[V]

2.5

Vcc(Max.)[V]

5.5

Circuit Current (Max.)[mA]

4.0

Standby Current (Max.)[μA]

10.0

Write Cycle (Max.)[ms]

4.0

Input Frequency (Max.)[Hz]

10M

Endurance (Max.)[Cycle]

106

Data Retention (Max.)[Year]

100

Features:

・ High speed clock action up to 10MHz (Max.)
・ Wait function by HOLDB terminal.
・ Part or whole of memory arrays settable as read only memory area by program.
・ 2.5V to 5.5V single power source action most suitable for battery use.
・ Page write mode useful for initial value write at factory shipment.
・ For SPI bus interface (CPOL, CPHA)=(0, 0), (1, 1)
・ Self-timed programming cycle.
・ Low Supply Current At write operation (5V) : 1.0mA (Typ.) At read operation (5V) : 1.0mA (Typ.) At standby operation (5V) : 0.1μA (Typ.)
・ Address auto increment function at read operation
・ Prevention of write mistake Write prohibition at power on. Write prohibition by command code (WRDI). Write prohibition by WPB pin. Write prohibition block setting by status registers (BP1, BP0). Prevention of write mistake at low voltage.
・ MSOP8, TSSOP-B8, SOP8, SOP-J8 Package
・ Data at shipment Memory array: FFh, status register BP1, BP0 : 0
・ More than 100 years data retention.
・ More than 1 million write cycles.
・ AEC-Q100 Qualified.

Design Resources

 

Documents

Application Note

  • Difference between BR25H-2C, BR25H-W(C) and BR35H-WC

Technical Articles

Schematic Design & Verification

  • Opcode, Address, and Page Configuration for SPI BUS EEPROM
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Thermal Resistance

Tools

Simulations (Login Required)

  • Method for Exporting Circuit Data (ROHM Solution Simulator)

2D/3D/CAD

  • TSSOP-B8 Footprint / Symbol

Packaging & Quality

Package Information

  • Package Information
  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)