ROHM Semiconductor - ROHM Co., Ltd.

ROHM FAQ

FAQ's

Is the thermal resistance θ_jc(Bottom) of a package with backside pad/fin/tab close to zero?
- Although the value of θ_jc(Bottom) of the backside (pad/fin/tab) is small, it does have thermal resistance, and thermal resistance also exists between the chip and backside. For additional details, refer to the technical materials.
  Related Link：Technical Document