UMN10NFH
High-speed switching, 80V, 100mA, Triple Switching Diode for Automotive

ROHM's switching diodes, including diode arrays, are available in high-reliability packages and stable supply for various applications.

New alternative products may be available.
Data Sheet Buy Sample
Data Sheet Buy Sample
  • Tools  
  • Packaging & Quality  
  • FAQs
  • Contact Us

Product Detail

 
Part Number | UMN10NFHTR
Status | Active
Package | UMD6
Unit Quantity | 3000
Minimum Package Quantity | 3000
Packing Type | Taping
RoHS | Yes

Specifications:

Grade

Automotive

Common Standard

AEC-Q101 (Automotive Grade)

Configuration

Triple Line

Package Code

SOT-363

Package Size [mm]

2x2.1 (t=1)

Package(JEITA)

SC-88

Mounting Style

Surface mount

Number of terminal

6

VRM[V]

80

Reverse Voltage VR[V]

80

Average Rectified Forward Current IO[A]

0.1

IFM[A]

0.3

Isurge[mA]

4000

Forward Voltage VF[V]

1.2

IF @ Forward Voltage [mA]

100.0

Reverse Current IR[µA]

0.1

VR @ Reverse Current [V]

70

trr[ns]

4

IF @ trr [mA]

5

VR @ trr [V]

6.0

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Features:

・Small mold package.
・High reliability.
SHOW/HIDE COLUMNS
New Product List

Design Resources

 

Technical Articles

Schematic Design & Verification

  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Diode)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Models

  • UMN10NFH SPICE Model
  • UMN10NFH Thermal Model (lib)
  • How to Create Symbols for PSpice Models

2D/3D/CAD

  • UMD6 STEP Data

Characteristics Data

  • ESD Data

Packaging & Quality

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations