BU7481G
High Speed Ground Sense Operational Amplifier

Low Voltage with High Speed CMOS Op-Amp integrates one independent output full swing Op-Amps and phase compensation capacitors on a single chip. Especially, this series is operable with low voltage, low supply current, high speed and low input bias current. Input-Output Full Swing : BU7291 family, BU7255 family Ground sense : BU7495 family, BU7481 family, BU7485 family, BU5281 family

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Product Detail

 
Part Number | BU7481G-TR
Status | Recommended
Package | SSOP5
Unit Quantity | 3000
Minimum Package Quantity | 3000
Packing Type | Taping
RoHS | Yes

Specifications:

Grade

Standard

Power supply (Min.) [V] (+5V=5, +/-5V=10)

1.8

Power supply (Max.) [V] (+5V=5, +/-5V=10)

5.5

Channel

1

Circuit Current (Typ.) [mA]

0.42

Input Offset Voltage (Max.) [mV]

8.0

Input Bias Current (Typ.) [nA]

0.001

Slew Rate (Typ.) [V/µS]

3.2

Input Voltage Range [V]

VSS to VDD-1.2

Output Voltage Range [V]

VSS+0.1 to VDD-0.1

Voltage gain (Typ.) [dB]

105.0

Output current (Typ.) [mA]

8.0

CMRR (Typ.) [dB]

60.0

PSRR (Typ.) [dB]

80.0

GBW (Typ.) [MHz]

2.8

Operating Temperature (Min.) [°C]

-40

Operating Temperature (Max.) [°C]

85

Package Size [mm]

2.9x2.8 (t=1.25)

Features:

・Low operating supply voltage
    +1.8 [V] ～ +5.5 [V] (single supply)
・High large signal voltage gain
・Internal ESD protection
    Human body model (HBM) ±4000 [V] (Typ.)
・Low input bias current 1[pA] (Typ.)
・High slew rate
    3.2 [V/μs]
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Design Resources

 

Documents

Application Note

  • Op amp Circuit Collection

Technical Articles

Schematic Design & Verification

  • Low-Side Current Sensing Circuit Design
  • Op-Amp / Comparator Tutorial
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Thermal Resistance

Tools

Models

  • BU7481G SPICE Model

2D/3D/CAD

  • SSOP5 Footprint / Symbol

Packaging & Quality

Package Information

  • Package Information
  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)