Attention to Internet Explorer users: ROHM website does not recommend browsing in IE 11. Please use latest browser to ensure the best performance on ROHM website.
ROHM will exhibit at PCIM Europe 2026, one of the leading international exhibitions for power electronics, held in Hall 9, Stand 318.
Nuremberg will once again be the hub of the European power semiconductor industry — and as a pioneer in this field, ROHM will of course be there again. Here you will find information about our trade show highlights, and after the event, we will also provide documentation on the exhibits for those who were unable to attend in person.
Starting with PCIM Europe 2026, ROHM introduces a refined booth design based on a white concept. The clean and bright environment provides an ideal setting to showcase advanced packages, modules, and application examples with clarity, presenting ROHM’s power solutions in a modern way.
Gen5 SiC: Advancing SiC Power Technology for E-Mobility and Industry
PCIM Europe is one of the world’s leading exhibitions and conferences for power electronics, intelligent motion, renewable energy, and energy management. It brings together international experts from industry and academia to exchange insights, technologies, and application trends. ROHM will demonstrate how cutting edge power semiconductor technologies contribute to higher efficiency.
1. Explore latest power packages and module solutions
Highlights include advanced discrete power packages and compact power modules, such as latest SiC modules and high-performance surface-mount power packages, allowing visitors to closely examine form factors, layouts, and structural design innovations.
2. Find out why packaging matters more than ever
In modern power electronics, performance extends beyond silicon to advanced packaging. ROHM’s exhibits show how package and module design enhance thermal performance, power density, and implementation flexibility.
3. Uncover wide-bandgap devices engineered with System-Level Expertise
Experience advanced discrete power packages and compact power modules up close — including ROHM’s latest SiC modules and high-performance surface-mount solutions — showcasing innovative form factors, optimized layouts, and sophisticated structural design.
4. Discover the design story behind every exhibit
Explore package structures such as TRCDRIVEpack™, HSDIP, and DOT247 in detail - from pin configuration to module composition - and experience how ROHM’s packaging concepts enable high-current performance, efficient heat dissipation, and robust system integration, beyond what specifications alone can show.
5. Learn from real application examples
Real-world application examples bring automotive and industrial use cases to life, demonstrating how ROHM’s packages and modules are successfully integrated into mass-production systems. These exhibits provide valuable inspiration and practical reference points for engineers addressing similar design challenges.
6. Start the technical conversation at the booth
Meet ROHM’s engineers and explore the ideas behind each exhibit - from design choices to real-world application context. Engage in expert discussions and gain insights tailored to your own development challenges.
Optimal Solutions for Next-Generation Ecosystems
Power Eco Family
In pursuit of carbon neutrality, the Power Eco Family addresses social issues by providing ideal solutions for ecosystems that optimize and enhance application performance
Ecosystem Components Centered on Product Features and Solutions